国家/地区 中国（14）
IPC部 C（6） B（5） H（5）
D（2）
IPC大类 C09（5） B01（3） H01（3）
D06（2） H05（2）
IPC小类 C09D（5） H01L（3） D06M（2）
D06N（2） H05K（2）
IPC C09D005/08（3） C09D007/61（3） H01L021/56（3）
H01L023/31（3） H01L023/373（3） C09D005/24（2）
C09D007/63（2） D06M011/74（2） D06N003/00（2）
D06N007/00（2） H01L021/52（2） H01L023/367（2）
H01L023/492（2） H05K009/00（2）
发明人 TANG H（14）
公开年 2020（14）
申请年 2020（10）  2019（4） 
专利权人 GREAT TEAM B.（3） SUZHOU KANGL.（3） CHANGSHA TIA.（2）

Double-sided printing head, has radiating cover whose end is provided with radiating fin, where radiating cover is filled with graphene particles and side of bottom end of connecting plate is provided with photoelectric sensor through fixing seat.

TANG H

Preparing graphene used in graphene dispersion slurry, by adding expanded graphite to aqueous solution of anionic surfactant and/or quaternary ammonium salt, ultrasonically treating mixed solution and removing liquid in graphene suspension.

ZHANG C, LI D, KUANG Z, TANG H

Electromagnetic interference shielding optimization coating comprises frame base layer, graphene thin layer and number of filler particles attached to frame base layer.

ZHOU Y, ZOU T, TANG H, XING C

Multi-layer composite graphene electromagnetic shielding material includes fabric substrate, where fabric substrate is sequentially covered with carbon-based shielding layer and aqueous polyurethane cured layer from bottom to top.

ZHOU Y, ZOU T, TANG H, XING C

Anti-biological and dirt adhesion and anti-corrosion water medium cooling tower comprises a tower body, a motor and a solvent-free graphene modified nano-heavy anti-corrosion material coating, where the bottom edge of the tower body is fixed with a motor.

MA J, TANG H

Method for packaging semiconductor, involves providing heat dissipation layer, and providing graphene heat dissipation layer on surface of substrate on which upper core is provided with insulating glue.

WANG X, TANG H

Packaged semiconductor used in electronic device, has metal layer which is arranged on surface of substrate that is graphene plate which is made of graphene material and chip is fixed on substrate through graphite-based die bonding material.

WANG X, TANG H

Packaging semiconductor for electronic product, has metal layer fixed on surface of substrate, main body of substrate connected with graphene plate, where graphene plate is made of graphene material, chip bonded on substrate.

TANG H, WANG X

Preparing agent used for exhibiting antibacterial effect, by mixing solution comprising silver nitrate and solution comprising maltose and polyvinylpyrrolidone, adding e.g. sepiolite powder, radiating graphene powder, and vacuum-drying.

MA J, TANG H

Bifunctional heterogeneous palladium-MIL101-sulfonated graphene oxide composite material for beta-alkoxyalcohol catalytic synthesis, is prepared by stirring e.g. sulfonated graphene oxide, terephthalic acid and chromium nitrate nonahydrate.

ZHANG Y, TANG H, LI X, ZHOU M, WU Q, LIU D