国家/地区 中国（9） 巴西（2） 欧洲专利局（EPO）（2） 日本（2） 韩国（2） 美国（2） 世界知识产权组织（2）
IPC部 C（6） H（5） B（2）
IPC大类 H01（5） C09（3） B82（2）
C01（2） C25（2）
IPC小类 H01L（4） B82Y（2） C01B（2）
C09J（2）
IPC B82Y030/00（2） B82Y040/00（2） C01B031/02（2）
C09J011/04（2） C09J163/02（2） H01L031/0352（2）
H01L033/00（2）
发明人 WANG J（9）
公开年 2011（9）
申请年 2010（4）  2011（4） 
专利权人 SUZHOU INST .（4） SUZHOU NANOW.（4） DARBOND TECH.（2）

Forming graphene used in e.g. bioanalytics involves providing graphite sample having atomic layers of carbon; introducing solvent and ions into spaces between the atomic layers; expanding space; and separating the layers using driving force.

LOH K P, WANG J, JUNZHONG B, LOH K, LUO J, ZUNZHONG W

Growing method of group III nitride substrate involves providing support substrate, forming graphene layer on surface of group III nitride semiconductor layer and forming group III nitride semiconductor layer on graphene layer.

CAI D, FAN Y, LIU Z, REN G, WANG J, XU G, XU K, ZHONG H

LED preparation method, involves forming continuous graphene cover layer on surface of nanometer column array layer, and forming metal electrode layer on surface of cover layer, where array layer is provided with semiconductor substrate.

CAI D, FAN Y, LIU Z, REN G, WANG J, XU G, XU K, ZHONG H

Growing method of graphene involves placing nitride substrate in center portion of plate heater, supplying non-oxidizing gas and carbon-containing substance, stopping supply of carbon source, and cooling grown product.

CAI D, FAN Y, LIU Z, REN G, WANG J, XU G, XU K, ZHONG H

Thermal conductive graphene-based epoxy resin adhesive useful for thermal conductive sealing of high-end electronic and electromechanical component, comprises e.g. graphene-based epoxy resin, reaction diluent, curing agent and enhancer.

XU Y, WANG J, XIE H

Applying a coating composition on substrate comprises preparing a coating by mixing carbon in form of carbon nanotubes, graphene and/or fullerenes with metal particles and two-dimensionally or selectively applying the coating on substrate.

ADLER U, RODE D, BURESCH I, WANG J, FRECKMANN D, SCHMIDT H, ROHDE D, WANG Y

Metal-semiconductor electrode structure used for nano semiconductor electronic devices, consists of semiconductor layer, metal electrode, and graphene layer arranged between semiconductor layer and metal electrode.

CAI D, FAN Y, LIU L, LIU Z, WANG J, XU G, ZHANG X, ZHONG H

Preparation of graphene-containing compound film material as electrode, involves preparing graphene oxide film, performing electrochemical process, reducing, obtaining graphene film and depositing platinum nanoparticles on graphene surface.

LIU S, YANG S, WANG J

Conductive adhesive for high-end refined electronic and electromechanical components, includes epoxy resin, reaction diluents, firming agent, accelerating agent, and strip silver powder modified by graphene.

XU Y, WANG J, XIE H