国家/地区 美国（29）
IPC部 C（29）
IPC大类 C01（29）
IPC小类 C01B（29） H05K（22） H01B（11）
H01L（11） B82Y（9） C09D（8）
C09K（7） C23C（7） C08L（6）
C08K（5） H01G（5） C08J（4）
H01M（4） H05H（4） B01J（3）
IPC C01B032/182（29）
发明人 ATIAS B（3） JANG B Z（3） LEVI A（3）
MENTOVICH E（3） NAVEH D（3） ZHAMU A（3）
BENNAIM Y（2） DANINO S（2） ELIYA Y（2）
HASEGAWA S（2） HASEGAWA SHOJI（2） KAMIYA N（2）
KAMIYA NAGISA（2） LIPP E（2） NAGISA K（2）
公开年 2015（8） 2022（5） 2018（4） 2021（4） 2013（2） 2016（2） 2017（2）
申请年 2015（6）  2022（6）  2014（5）  2017（4）  2020（3）  2018（2） 
专利权人 MELLANOX TEC.（3） NANOTEK INST.（3） UNIV BARILAN（3） GRAPHENE PLA.（2）
GRAPHENE PLA.（2） JANG B Z（2） PCB TECHNOLO.（2） ZHAMU A（2）

Article e.g. rear window for motor vehicle comprises substrate and resistive heating element containing graphene, carbon nanostructure (CNS) material different from graphene, and glass frit, and graphene and CNS material containing adhesion promoter.

DELLOCK P K, KIZILTAS A, SALTER S, GLICKMAN D B, BOETTGER T F, BERTGE T F

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Upper electrode assembly used in plasma processing apparatus, has heat transfer sheet that is mounted between electrode plate and metal plate and having vertically oriented portion with vertically oriented graphene structures.

TSUJIMOTO H, KOBUNE T, LI L, LEE L, KOBUNEDAKAKI

Plasma enhanced chemical vapor deposition method used in semiconductor structure, comprises turning on radio frequency source of radio frequency system to decompose aromatic hydrocarbon precursor into multiple active radicals at specific frequency to form graphene layer on magnetic layer.

WU Z, NI I, XU Y, HUANG J, WU C, HSU Y, HUANG J Z, HSU Y H

Composite material for shielding or absorbing electromagnetic wave in e.g. smart phone, has electromagnetic absorbing material comprising silicon carbide, and conductive material comprising two-dimensional carbon material containing graphite sheet and graphene sheet.

CHU Y S, KE Y, HSIEH C, HSIEH I, HO H, LIU W, ZHU J, XIE Z, XIE Y, HE X, LLKE Y, LLCHU Y S

Dry graphene powder composition used in graphene ink used in two- or three-dimensional printing comprises pristine graphene flakes non-covalently functionalized with polymeric amphiphilic molecules.

TRAN T S, ROY CHOUDHURY N, DUTTA N, ROY C N, AWARD T, ROICHOUDURINAMITA, DUTANABA, DUTA N

Preparation of graphene oxide platelet-filled polyimide film for electronic devices, involves mixing graphene oxide platelets with polyimide precursor material and liquid to form slurry, forming wet film from slurry, and imidizing film.

HSIAO M, ZHAMU A, JANG B Z

Printing circuit in aerosol jet process or plasma jet process comprises dispersing graphene into cyclohexanone/terpineol to form graphene ink and printing circuit in aerosol jet process or plasma jet process using the graphene ink.

FUJIMOTO K, ESTRADA D, SUBBARAMAN H