国家/地区 中国（13） 世界知识产权组织（5）
IPC部 C（18）
IPC大类 C08（18）
IPC小类 C08J（18） C08L（15） C08K（14）
B29C（4） C08G（4） B32B（2）
H05K（2）
IPC C08J005/24（18）
发明人 ZHANG W（3） CHEN C（2） GUO M（2）
HE J（2） LIU H（2）
公开年 2023（18）
申请年 2022（15）  2023（2） 
专利权人 CHANGSHU SHE.（2） SHENGYI TECH.（2）

Composition used to produce thermoset composite material comprises cyanate ester comprising difunctional cyanate ester compound and polyfunctional cyanate ester moiety and substituted bisimide compound comprising biscitraconimide compounds.

LA DELFA G, FOURNIER J, ABGOTTSPON M, MAYERHOEFFER U, ELLINGER S

Apparatus used for preparing composite for e.g. pipe, has container containing resin, another container containing hardener, metering unit to output treating mixture, and treatment device to receive filament and treating mixture, and treat filament with treating mixture to produce composite.

POTLURI P, BISSETT M, KONCHERRY V, ZAKARIA M, AHAMID Z

Bismaleimide resin composite material useful for carbon fiber prepreg, comprises o-diallyl bisphenol A, bismaleimide resin, accelerator, and graphene.

CHEN L, LIU H, JIAO L, LV X

5G antenna cover used in mobile communication system, comprises modified polycarbonate resin, modified acrylonitrile styrene acrylate resin, basalt fiber, low-dielectric glass fiber, filler with hollow structure, toughening modifier, halogen-free flame retardant and weather resistance agent.

LI C

Preparing continuous fiber reinforced aromatic polyimide 3D printing thermal conductive composite material comprises e.g. impregnating continuous fiber filaments or tapes in aromatic polyimide prepolymer/thermal conductive filler, adjusting glue content and ribbon shape, curing resin.

LIU S, ZHAO J, LI L, YUAN Y

Graphene epoxy resin composite material comprises bisphenol A solid epoxy resin, bisphenol A liquid epoxy resin, toughening agent, phenolic novolac epoxy resin, graphene, curing agent, and accelerator.

ZHANG W, WANG Z, YAN S

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Molded prepreg used for high-performance heat-resistant composite material comprises e.g. linear phenolic resin, modified antioxidant fibers, catalyst, ceramic hollow microspheres, coupling agent, zirconium-silicon polymer ceramic precursor pyrolysis powder, and toughening agent.

YANG W, ZHOU P

Hot-melt bisphenol-containing cyanobenzoxazine resin prepreg composite material useful for preparing hot-melt bisphenol-containing cyanobenzoxazine resin-based composite material and hot-melt bisphenol-containing cyanobenzoxazine resin.

GAO Y, ZHANG L, YIN P

Resin composition useful in preparing low-flow adhesive prepreg comprises epoxy resin, epoxy curing agent, curing accelerator, carboxylated nitrile rubber, carbodiimide compound.

ZHANG W, CHEN C, HE J