国家/地区 中国（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08K（8） C08L（7） H05K（7）
C09D（4） H01L（4） C09K（3）
B29C（2） C08F（2） C08G（2）
C08J（2） G06F（2） H01B（2）
IPC C08K003/04（8）
发明人
公开年 2018（2） 2022（2）
申请年 2019（2） 
专利权人

Thermally conductive composite material used in virtual reality device, comprises polyamide 6, elastomer and thermally conductive filler comprising aluminum nitride, graphite, boron nitride, and/or graphene.

FANG X, LIU M, LIU P, REN Y

Composite for autoradar sensor for electromagnetic radiation comprises thermoplastic resin which comprises polyester, and carbon-based filler which has a predetermined primary surface area.

SILVI N, NARANG K J, SAS M, JUNG H, JIANG J

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Processing boron fiber reinforced unsaturated resin sheet forming and stress measurement comprises e. g. forming graphene powder by modifying graphene with silane and adding graphene powder into acetone solution.

WANG A, LI J, NIU Q, LI S, LI N

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A