国家/地区 中国（16）
IPC部 B（16）
IPC大类 C08（16） B32（8） B29（4）
B60（3） B82（3） C01（2）
H05（2）
IPC小类 C08K（16） C08L（15） C08J（12）
B32B（8） B82Y（3） B29C（2）
C01B（2） C08G（2） H05K（2）
IPC C08K007/24（16）
发明人 LI H（2） LI J（2） LIU J（2）
XU W（2） ZHANG C（2）
公开年 2021（16）
申请年 2021（9）  2020（5）  2019（2） 
专利权人 CHINA PETROL.（2）

Preparing sound-absorbing conductive composite plate comprises e.g. obtaining preprocessed particles, carrying out vacuum pressure treatment, preparing foamed material, dispersion, three-dimensional graphene, large-scale graphene aerogel and sound-absorbing conductive core material and shaping.

ZHANG Q

Component e.g. cross component e.g. cross beam of vehicle, comprises polymeric material, carbonaceous filler dispersed in polymeric material, and filler comprising substrate, and carbon nanotubes extending from surface of substrate.

BUDAJ J, BUSUIOC D, GALL R, DELLOCK P K, SALTER S C, RICHARD G

High-absorption electromagnetic shielding composite film for preparation of electromagnetic shielding materials, is double-layer composite film made of film made of porous carbon material and polymer matrix material, and another film made of conductive material and polymer matrix material.

SHEN L, ZHANG H, CHEN Y, FEI Y, YUAN M, ZOU H

Single micelle guided interface assembly method of mesoporous alumina-based core-shell composite material used in catalytic field, by mixing surfactant and aluminum source, drying, mixing with functional core and hydrothermally reacting.

ZHAO D, ZHU K, ZHANG W, LI W

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Preparing polyurethane prefabricated direct-buried thermal insulation composite pipe, comprises nesting working pipe and fixing in outer protective pipe, forming cavity, and adding polyurethane stock solution for free pressure foaming.

SHI Q, LIANG H

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Foam extrusion molding of polymer cornerstone ink by series of explosion and blending comprises e.g. soaking expanded graphite in deionized water and fully stirring, distributing, and then continuously extruding.

WU T, XU W, QU J

High thermal conductivity composite film used for, e.g. aerospace comprises premixed material layer comprising thermally conductive filler, auxiliary agent and adhesive, and in-plane reinforcement layer.

DUAN C, LIU J, WANG Q, ZHENG D, LIANG W, XU W

Graphene polyurethane composite sponge material with good air permeability comprises polyol, polyisocyanate, graphene-zeolite composite, porous ceramic particles, opener, silane coupling agent, and foaming agent.

WANG B