国家/地区 中国（14） 韩国（5） 世界知识产权组织（3） 美国（2）
IPC部 C（21） B（4）
IPC大类 C08（21）
IPC小类 C08K（21） C08L（12） C09K（11）
C09D（4） C09J（4） C01B（3）
C08G（3） C08J（3） C09C（3）
IPC C08K009/02（21）
发明人 KYOUNGJEONGBAE（2） LIU Y（2） SU Y C（2）
ZHANG X（2）
公开年 2022（21）
申请年 2022（12）  2021（8） 
专利权人 ELEMENT CO L.（2）

Manufacture of packaging film for e.g. detergent, involves applying non-solvent two-component adhesive composition to base film on which printed layer is formed, drying, laminating base film, aging and processing film into desired shape.

JEONG H R, LEE D H

Graphene oxide-biomass-based fatty acid composite material used in composition for preparing rubber products, is obtained by modifying graphene oxide with biomass-based fatty acid and metal ion source.

ZHANG N, DONG D, WANG W, ZHEN B

Graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility comprises first dispersion solution is dispersed and second dispersion solution in which ceramic heat-dissipating filler is pulverized.

KYOUNGJEONGBAE, CHO J I, YANG H J, SONG H, SU Y C

Producing graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility, comprises preparing first dispersion solution by dispersing graphene interlayer material in aqueous solvent.

KYOUNGJEONGBAE, SU Y C

Polyol-modified aspartic two-component polyurea-based composition useful as e.g. heat dissipation adhesive for electronic devices, comprises aspartic ester resin and polyol, polyisocyanate, and thermally conductive inorganic filler.

KIM H J, JANG J G, SEO K H

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Graphene antibacterial agent used in metal, ceramic and plastic, comprises fixing material and hydroxyl modified graphene composite material, fixing material is aqueous polymer resin, hydroxyl modified graphene composite material comprises hydroxyl modified graphene, inorganic oxide and/or hydroxide.

LI N, WANG H, JIANG B, SONG Q

Composite powder for heat dissipation coating, includes graphene and silicon dioxide microsphere, where graphene and silicon dioxide microsphere are combined together through chemical bond, graphene has preset average transverse size, and silicon dioxide microsphere has preset particle size.

HE P, DING G, ZENG X

Preparation of heat-conducting composite material for use as e.g. filler, involves preparing eutectic solution, performing high-speed shearing stress treatment of prepared dispersion liquid twice to obtain nano hexagonal-boron nitride, and preparing hydroxylated nano hexagonal-boron nitride.

LIU N, HUANG Y, FANG C, CUI Y, LI S

Preparing conductive material in conductive sealing strip, involves preparing graphene oxide water solution, immersing dried polyurethane foam and vacuum drying, and further immershing in mixed solution of hydriodic acid and glacial acetic acid to obtain conductive reinforcing filler water solution.

HUANG Z, XIAO Q, XIONG J, GAO R, LIAO S