国家/地区 中国（12）
IPC部 C（12） B（3） H（2）
IPC大类 C08（12）
IPC小类 C08K（12） C08L（12） C09K（8）
C09D（4） C09J（3） B32B（2）
IPC C08L063/00（12）
发明人 CHEN Z（3） LI J（2） SHI L（2）
WANG J（2）
公开年 2020（12）
申请年 2020（7）  2019（4） 
专利权人 CHEN Z（2） UNIV SHANGHA.（2）

Graphene electric heating film comprises upper protective layer, graphene electric heating layer, insulation layer and lower protective layer, where graphene electric heating layer comprises base layer and graphene coating.

XU J

Polymer chemical material comprises aluminum trichloride hexahydrate, urea, graphene, aromatic dianhydride, aromatic diamine, epoxy resin, curing agent, and dispersant.

LUO C

Directionally arranged graphene/epoxy resin composite material with high thermal conductivity comprises graphene soaking film pieces as thermally conductive fillers, and epoxy resin poured and coated with thermal conductive fillers.

WANG J, SHI L, YU P, LIU H

Preparing graphene heat dissipation film, involves adding epoxy acrylic resin, performing emulsification treatment, centrifuging, pouring, cutting adhesive sheet, adhering to graphene sheet with bioadhesive and pressing sheet.

CHEN Z, MIAO L, ZHANG C

Preparation of composite material for e.g. adhesive, involves adding graphene oxide and reducing agent to water, dispersing, heating, removing excess water, adding hydrogel block to aqueous epoxy resin and curing agent and curing.

CHEN Z

Preparing composite material useful in thermally conductive materials comprises e.g. adding graphene oxide and reducing agent to deionized water, dispersing, heating to obtain graphene hydrogel, and replacing with deionized water.

CHEN Z

Thermosetting resin composition comprises thermosetting resin matrix, graphene nanosheets and one-dimensional linear thermal conductive bridging filler.

XU H, XU W, WANG J, ZHAO L, LIU T, MA Q, LI J

Preparing aqueous epoxy resin graphene composite material by dispersing graphene oxide and reducing agent in deionized water, heating, removing water, adding graphene hydrogel block to epoxy resin, adding curing agent, and solidifying.

WANG Y

Resin composition comprises epoxy resin, bisphenol A, phenolic resin and inorganic filler, inorganic filler comprises metal oxide, metal nitride, metal carbide, and/or graphene in metal hydroxide.

LIN C, CAI X, YANG G, LIANG Y, GAO Y, SU J

Composite material useful for automobiles, computers and LED heat dissipation comprises 3D carbon fiber graphene aerogel and polymer resin.

DING P, XU T, SONG N, SHI L