国家/地区 中国（8） 日本（2） 韩国（2） 美国（2） 世界知识产权组织（2）
IPC部 C（9） H（9） B（2）
IPC大类 C08（9）
IPC小类 C08L（9）
IPC C08L063/00（9）
发明人 CHI S（2） JI S Y（2） KIM S（2）
KIM S H（2）
公开年 2021（4）
申请年 2020（4）  2021（2） 
专利权人 SAMSUNG ELEC.（2）

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Preparation of graphene insulating and thermally conductive sheet for electric vehicle power supply, involves e.g. coating surface material on surface of middle layer, and hot pressing to form surface layer of thermal conductive sheet.

JIA T, HONG W, ZHOU R, XI X, YANG F, LI M

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Graphene multilayer circuit board heating chip comprises epoxy resin glass fiber plate as substrate layer, electrode layer connected with graphene layer, and epoxy resin glass cloth as top layer.

CHEN L

Graphene electric heating film comprises upper protective layer, graphene electric heating layer, insulation layer and lower protective layer, where graphene electric heating layer comprises base layer and graphene coating.

XU J

Graphene/epoxy composite wave-absorbing material used in graphene/epoxy composite coating, comprises epoxy resin and radial graphene clusters that are dispersed in epoxy resin.

LIU L, GAO L, LI Q, LI W, GUO Y, ZHANG H

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN