国家/地区 中国（51） 世界知识产权组织（2）
IPC部 C（51）
IPC大类 C09（51） C08（13） H05（3）
IPC小类 C09J（51） C08G（11） C09C（3）
H05K（3）
IPC C09J163/02（51）
发明人 LI X（4） LI Y（4） LIU J（4）
WANG J（4） XU X（4） GAO H（3）
LI H（3） LIU L（3） WANG Q（3）
ZHAO Y（3） DENG X（2） HU Q（2）
LI Z（2） LIU K（2） MA J（2）
公开年 2022（16） 2021（15） 2023（7） 2020（4） 2011（3） 2013（2）
申请年 2022（18）  2021（12）  2020（10）  2010（2）  2011（2）  2023（2） 
专利权人 CHANGZHOU SH.（2） DARBOND TECH.（2） UNIV GUANGXI.（2）

Heat-conducting adhesive film useful for electronic module, comprises e.g. epoxy resin, epoxy resin curing agent, film-forming resin, ethylene glycol diglycidyl ether, silicon micropowder, glass powder, nano-dioxide, quartz powder, aluminum nitride, silicon nitride and graphene oxide.

XU J, HUANG Z, QI F, ZOU W, PENG T

Low-density composite electromagnetic shielding plate used in electronic product comprises electromagnetic wave-absorbing foam layer arranged between two composite shield layers, and composite shielding layer, and glass fiber-reinforced epoxy insulating layer are alternately stacked.

LI H

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Thermally-conductive pressure-sensitive adhesive useful in preparing thermally-conductive pressure-sensitive adhesive film, and in power batteries of energy vehicles, comprises epoxy resin composition, acrylate copolymer, thermally-conductive filler, curing agent, and photoinitiator.

JIANG B, ZHANG Z, YU D

Preparing high-reliability epoxy resin absorbing adhesive film with controllable fluidity by mixing epoxy resin matrix and toughener to compound epoxy resin system, placing epoxy resin system, absorbent, and inorganic filler into resin internal mixer for banbury rough mixing and fine mixing.

GONG Y, LIU J, LI M, LI Y, LV T

Flame retardant modified epoxy resin adhesive film useful in technical field of high molecular materials, aerospace, electronic device, traffic transportation, building material, and defense military industry, comprises e.g. phosphabicyclo-triazine derivative modified graphene and epoxy resin.

WANG S, WANG C

High heat-conducting adhesive tape comprises rubber, epoxy resin, heat conducting agent, dispersant, antioxidant, curing agent, coupling agent, Graphite and nitride.

JIANG X, LIN Y, ZENG H, QIAN X

High-thermal-conductivity nano-sintered silver paste used as interface material for e.g. high-speed computer chips, comprises silver powder, epoxy resin, activator, initiator, organic solvent, and graphene oxide modified with e.g. cyanate ester resin.

ZHAO J, LI X, FENG D, JIAO K, YIN W

Environmentally-friendly epoxy grouting material used in e.g. concrete crack treatment, comprises epoxy resin, non-reactive diluent, reactive diluent, nano particles, curing agent, toughener and accelerator.

ZHU S

Improving electromagnetic shielding performance of magnetic suspension motor sealant, comprises adding mixed modified graphite to polymer resin pouring sealant to improve electromagnetic shielding performance of sealant.

ZHU B, LI C, PAN J