国家/地区 中国（13）
IPC部 C（13）
IPC大类 C09（13） C08（3） H01（3）
H05（2）
IPC小类 C09J（13）
IPC C09J183/07（13）
发明人 CHEN Y（2） LIU G（2） LU R（2）
ZHU L（2）
公开年 2021（13）
申请年 2021（7）  2020（5） 
专利权人 SHENGDA TECH.（2）

Adhesive tape used for fixing flexible circuit board comprises release film, first adhesive layer (e.g. tripropylene glycol diacrylate), base material layer (polyethylene terephthalate polyester slice), second adhesive layer (acrylate and maleated rosin), and foam layer (polyethylene particles).

GUO Y

Preparing high-temperature-resistant low expansion coefficient copper clad laminate, involves coating high heat-conducting medium layer on one side of aluminum substrate, installing copper foil layer on one side of medium layer, and coating heat dissipation adhesive layer on other side of substrate.

LI Y, LIU Q, SU X

Double-component addition type heat-conducting silica gel useful for radiating light-emitting diode lighting chip comprises base silicone oil, catalyst, thermally conductive filler, reinforcing and toughening additives, hydrogen-containing silicone oil, inhibitor, and graphene.

CAO Y, CHEN W

Preparing electromagnetic reflecting material with high transverse longitudinal specific heat management structure comprises e.g. uniformly coating graphene slurry on aluminum metal plate, drying, cutting, bonding, pressing and molding.

FU H, XU F, ZHAO X, HOU J, PENG Q, HE X

Organic thermal grease comprises silicone oil, thermal powder, thixotropic agent, leveling agent, and coupling agent.

TANG Z, CHEN Y

Encapsulation adhesive film comprises first adhesive film substrate and multiple organic high refractive index portions, where organic high refractive index portions are arranged at intervals on surface of first adhesive film substrate.

WEI M, WANG F, ZHOU G

Preparing composite insulator interface adhesive with barrier property involves mixing the ethyl orthosilicate with triethoxysilane, obtaining silane solution, mixing the silane solution and ethanol, water, adding graphene oxide.

WANG Z, PENG X, HUANG Z, YU X, LI Z

Super-soft conductive adhesive useful for 5G frequency spectrum, comprises conductive particles, cross-linking agent, curing agent, reinforcing agent, thixotropic agent and curing retardant, and silicon rubber carrier.

DENG S

Low density high temperature resistant pouring sealant comprises vinyl silicone oil, cross-linking agent, metal-organic frame material, heat-conducting filler, platinum catalyst and inhibitor.

LU R, ZHU L, LIU G

LED packaging glue comprises vinyl silicone oil, phenyl silicone oil, vinyl silicone resin, platinum catalyst, dendrimer graphene composite material, dendrimer gold/silver nanocrystalline composite material and vinyl silicone oil.

LUO Y, GUO Q, YI B, ZHANG J, WU X