国家/地区 中国（12）
IPC部 C（12）
IPC大类 C09（12）
IPC小类 C09J（12）
IPC C09J183/07（12）
发明人 TANG R（2） WANG Y（2）
公开年 2022（12）
申请年 2021（6）  2022（6） 
专利权人 NINGBO YUANC.（2）

Heat-conducting wave-absorbing material with electromagnetic shielding function has a two-layer structure, the upper layer is a heat-conducting wave-absorbing gel layer, and the lower layer is an aluminum foil layer.

ZHANG X, YANG Y, FAN J, ZHANG C, MA C, WANG Z

Thermally conductive adhesive used for bonding electronic circuit base plate for circuit board, comprises composite resin, thermally conductive filler, vinyl-terminated silicone oil, platinum catalyst, curing agent and leveling agent.

ZHONG L, LI R

Low-viscosity flame-retardant heat-conducting solvent-free polyurethane electronic potting adhesive comprises polyether polyol, modified polyurethane prepolymer, heat-conducting powder, modified graphene oxide, vinyl silicon oil, fire retardant, anti-foaming agent, dispersing agent, coupling agent.

WANG Y, TANG R

Low viscosity high heat conductivity flame retardant two-component polyurethane potting sealant useful for bonding electronic component comprises e.g. polyurethane pre-polymer, composite flame retardant material, heat conductive filler, amide tin catalyst and organosilicone defoaming agent.

TANG R, WANG Y

Single-component addition type heat-conducting bonding agent comprises vinyl silicone oil, heat conducting filler, surface treatment agent, tackifier, pH value regulator, hydrogen-containing polysiloxane, catalyst, and inhibitor.

LIU J, YU L

Organic potting adhesive useful in LED encapsulation, comprises polysiloxane, modified graphene, heat conducting filler, fluorine-containing terminal vinyl silicone oil and crosslinking agent, where the modified graphene is amino modified graphene.

LAI J, ZHOU P, YU G

Injection type planting tendon glue comprises modified filler, thixotropic agent, thinner, coupling agent, flexible curing agent, accelerator, novolac epoxy resin and bisphenol A type epoxy vinyl resin.

ZHANG H, ZHANG W

Preparing heat conducting electronic potting adhesive comprises adding terminal disiloxane monomer to ethanol solution, stirring, hydrolyzing, vacuum distilling, filtering, adding e.g. vinyl polydimethylsiloxane and modified radiating filler and platinum catalyst, stirring, kneading and defoaming.

SUN X

Non-hydrogel flexible electronic packaging material used in embedding flexible electronic circuit device, comprises low volatility non-water filling medium, organic silicon copolymer, vinyl silicon oil, modified nano filler and crosslinking agent.

ZHOU R, ZENG J, LUO Y, YE S, CHEN Y, GONG J, HE J

Preparing transparent silica gel with high flexibility and low exudation involves adding vinyl silicone oil, adding catalyst and inhibitor into stirring device, adding hydrogen-containing silicone oil into stirring device, pouring mixture in stirring device, filtering and packing to obtain product.

HUA Y, CHENG Y