国家/地区 中国（9）
IPC部 C（10）
IPC大类 C09（10） C08（5） C01（2）
IPC小类 C09K（10） C08K（5） C08L（4）
C01B（2）
IPC C09K005/14（10）
发明人 WANG W（10）
公开年 2021（6） 2022（3）
申请年 2021（5）  2020（3） 
专利权人 TAIXING ZHIF.（3）

Producing graphene composite film useful in heat dissipation material for ultra-large-scale consumer electronics, comprises vacuum pressing an expanded graphite powder and a graphene film to obtain the graphene composite film.

ZHOU Y, LIU X, WANG W, LI L, CHENG W

Preparing graphene-based alkenyl epoxy resin heat-conducting composite material, involves reacting pyrenyl hyperbranched polyethylene terpolymer, functional assistant, mixing obtained graphene dispersion liquid with epoxy resin, chloroform.

YE H, WANG Q, WANG W, XU L

Graphene and carbon black compound reinforced thermal conductive filler, obtained by compounding modified graphene PMIGNP and modified carbon black PMICB.

MIAO J, QIAN J, CAO M, CHEN P, WU B, WANG W, XIA R

Graphene composite radiating film comprises n-layer graphene film and m-layer worm graphite film.

CHENG W, LIU X, ZHOU Y, WANG W, LI L

Preparing compact flexible graphene/polystyrene composite heat conducting film involves drying graphene oxide powder, sieving, grinding graphene oxide powder, styrene and zirconium ball, and coating graphene oxide styrene dispersion liquid.

WANG W, SONG X, LIU T, XU X, MA L, XU R, HOU S

Graphene composite radiating film useful for preparing radiating material, prepared by carbonizing graphene film, subjecting expanded graphite powder to microwave treatment, and vacuum pressing expanded graphite powder and graphene film.

ZHOU Y, LIU X, WANG W, LI L, CHENG W

Preparing thermal interface material based on high-density graphene interconnection network structure by placing copper powder in quartz mold, introducing reaction gas to grow grapheme, removing copper frame by etching, forming and cutting.

ZHANG L, WANG X, YE Q, WANG W

Thermal interface material used in interface connection method to connect electronic devices, comprises intermediate layer and framework structure comprising metal or alloy framework structure of micro-nano size.

LIU L, REN H, JIANG Y, WANG W, ZOU G

Low-temperature resistant polymer insulating and thermally conductive composite material comprises e.g. high-density polyethylene, micron silicone oil lubricant epoxy resin matrix, curing agent, polypropylene resin and polyimide.

DU C, JIA X, WANG W, YU H, YAN Y

Graphene-metal powder composite conductive heat-conducting plastic comprises conductive filler, main plastic portion and coupling agent, where conductive filler comprises mixture of metal powder and flaky graphene.

GONG H, CHEN Y, WANG W, WANG D, ZHANG Z, ZHANG S