国家/地区 中国（19） 韩国（4） 美国（2） 世界知识产权组织（2）
IPC部 C（23）
IPC大类 F21（23）
IPC小类 F21V（23） F21Y（18） C08K（9）
C09D（8） C08L（6） C09K（6）
F21K（5） F21S（5） B29C（2）
C01B（2） C09J（2） C25D（2）
F21W（2） H05K（2）
IPC F21V029/85（23）
发明人 ZHUANG K（3） CHEN W（2）
公开年 2017（6） 2021（6） 2016（4） 2018（2） 2019（2） 2022（2）
申请年 2016（6）  2017（4）  2021（4）  2019（3）  2020（3）  2015（2） 
专利权人 ZHUANG K（3） AMOGREENTECH.（2）

LED heat dissipation lighting light surface treatment composition useful for street lamp case comprises heat dissipation unit made of aluminum which is formed in multiple body portion and radiates heat generated from lighting module.

WOO L, UK L D

Use of graphene film as high temperature resistant thermal interface material or heat dissipation film material.

CHENG H, LIU H, MA C, REN W

Preparing graphene heat-dissipating paint by adding vermicular graphite to aqueous solution of ammonium carbonate for soaking, filtering, drying, pressing, puffing, adding to oxalic acid and potassium ferrate mixed aqueous solution, performing shearing and stripping treatment, sanding and filtering.

JIAO Y, YANG Z, ZHAO Z, ZHANG Z

Double-component addition type heat-conducting silica gel useful for radiating light-emitting diode lighting chip comprises base silicone oil, catalyst, thermally conductive filler, reinforcing and toughening additives, hydrogen-containing silicone oil, inhibitor, and graphene.

CAO Y, CHEN W

Graphene heat dissipation lamp for studying, comprises graphene composite thermally conducting plastic radiator comprising outer thermal conductive layer and inner thermal conductive layer and LED light source board mounted on radiator.

YAO L, TANG J, WANG K, CHEN Z

Paint composition having excellent heat dissipation effect useful for producing light-emitting diode lighting fixture, comprises aluminum nitride powder, epoxy resin, boron nitride powder, photoinitiator and conductive material.

KIM S W, LIM J J

Light emitting diode headlamp module for automobiles, consists of metal plate for supporting lamp, and heat dissipation case formed of heat-resistant plastic, and comprising region accommodating metal plate, and region having protrusion.

LEE H K

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

LED heat-dissipating coating comprises primer layer comprising epoxy resin, graphene, filler, dispersant, curing agent and cross-linking agent, and surface coating layer comprising titanium dioxide, diatomaceous earth and flame retardant.

MIAO F

Preparing orientation arrangement magnetic carbon fiber graphene composite film useful for light emitting diode heat dissipation, comprises e. g. adding carbon fiber into dispersing agent, stirring, sonicating and vacuum filtering.

LI J, LEI R, CHEN Y, KANG Z