国家/地区 美国（8） 中国（6） 世界知识产权组织（4） 欧洲专利局（EPO）（3） 法国（2） 日本（2）
IPC部 F（11）
IPC大类 F28（11） H01（8） H05（7）
B32（4） B82（3） C01（3）
C22（3） B05（2） B22（2）
C08（2） C09（2）
IPC小类 F28F（11） H05K（7） H01L（6）
B32B（4） C01B（3） C22C（3）
B05D（2） B82Y（2） C08J（2）
C09K（2） F28D（2） H01B（2）
IPC F28F021/08（11）
发明人
公开年 2014（2） 2016（2） 2018（2）
申请年 2014（3）  2018（2） 
专利权人

Metal-based composite material for use in heat sink of electronic device, has reinforcement particles comprising silicon carbide particles, diamond particles, boron carbide particles or graphene particles dispersed in metal matrix, where metal matrix has single metal matrix or alloy matrix.

WANG L, LI Q, ZHAO J

Graphene vinyl chloride soaking plate, has capillary core layer formed between upper layer plate and lower layer plate, where inner portion of lower layer plate is provided with filling chamber.

LI G, ZHANG C

Metal matrix nanocomposite used as e.g. load-bearing element, comprises metal or metal alloy containing gold and silver as matrix material, and multiple graphene sheet chosen from pristine graphene material or non-pristine graphene material.

ZHAMU A, LIN Y, JANG B Z

Forming graphene-doped aluminum composite for thermal management component i.e., avionics chassis, heat spreader, heat sink, heat exchanger, radiator, or heat pipe, by crystallizing aluminum around substantially uniformly dispersed graphene.

BLAND A, RAINBOW A J, SIDGWICK D H, SMITH M J, BRAND A, LINBO A J

Method for manufacturing heat spreader for printed wiring board, involves depositing layer of metal on layer of molybdenum and joining first and second graphene sheets to each other by alloy bonding first and second metal layers.

STARKOVICH J A, TICE J B, ZENG X, KOSTELEC A D, PENG H, SILVERMAN E M

Graphene thermal conductivity coating modified radiator comprises e.g. outer surface with graphite heat-conducting layer of radiating substrate connected with radiating substrate or outer surface of conducting graphene layer.

XU H, ZHOU Q

Composite structure comprises organic resin, carbon fiber and flat graphene nanosheets embedded in resin.

LUTZ M, TANZILLI D, BURGER N, LAACHACHI A

Graphene-based thermal management core for printed wiring boards (PWB) used for electronics applications, e.g., consumer electronics, has first or second reinforcement layer which includes substrate impregnated with non-dielectric resin.

SCHNEIDER D, DAVIS W E

Composite material used for thermal-conducting material for thermal management of collagen, comprises metal matrix and graphene platelets dispersed in the metal matrix with random orientation.

KIM N P

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X