国家/地区 中国（8）
IPC部 H（8） C（4）
IPC大类 H05（8） C25（4）
IPC小类 H05K（8） C25D（4）
IPC H05K003/42（8）
发明人 CAO X（2） MA Y（2） YE G（2）
ZHANG J（2） ZHENG K（2）
公开年 2021（8）
申请年 2020（4）  2021（4） 
专利权人 CHINESE ACAD.（2）

Method for treating substrate surface for electroplating flexible circuit board, involves pre-washing surface of substrate to be electroplated, and coating prepared graphene dispersion liquid on pre-washed substrate surface to be electroplated to form conductive layer for direct electroplating.

ZHENG K, CAO X, YE G, ZHANG J, MA Y

Processing substrate hole comprises e.g. pre-washing substrate, soaking pre-washed substrate in prepared graphene dispersion liquid, soaking liquid in hole structure, ultrasonically treating, drying to form conductive layer for direct plating.

CAO X, ZHENG K, YE G, ZHANG J, MA Y

Graphene sheet/carbon black composite black hole liquid useful in printed circuit board, comprises graphene sheet, carbon black, surfactant, aqueous high molecular polymer, potassium hydroxide solution and deionized water.

WANG J, LI Z, CAO L, BAI J, FANG B, HAO L

Multi-layer hole metallization involves ball milling graphene, dispersant, solvent, and water, mixing with metal nanowire dispersion, conductive polymer, and thixotropic agent, forming conductive paste, treating multilayer plate with conductive paste, micro-etching, and treating with antioxidant.

HU L

Preparation of black hole liquid for printed circuit board, involves taking graphite plate, titanium plate or graphite plate, using ultra-pure water or aqueous ammonia as electrolyte, electrolyzing, adding conductive agent and adhesive.

WU Z, XIAO C, MO S, LIN J, SUN Y

Component carrier useful as printed circuit board, comprises stack comprising electrically conductive layer structures and electrically insulating layer structure, back-drill hole, and etching neck connecting back-drill hole with end portion of vertical through-connection.

SEBASTIAN L, KASTELIC M, MARKUS K, LACKNER S

Carrier for e.g. electronic components comprises stacked electrically insulating layer structures, and through hole with narrower inner portion compared to exterior portions and filled with electrically conductive filler.

TUOMINEN M, TAY S K, SUN S, ZHANG R, ZHENG X, SUN L, ZHANG Z

Metallization of PTFE circuit board holes involves preparing liquid phase dispersion graphene solution, soaking PTFE circuit board in graphene solution, volatilizing solvent, and performing chemical copper deposition.

HUANG M, WEN G, LI X