国家/地区 中国（7）
IPC部 C（7）
IPC大类 C09（7） H01（3） H05（3）
B32（2）
IPC小类 C09J（7） H01L（3） H05K（3）
B32B（2）
IPC C09J201/00（7）
发明人 ICHIKAWA I（3） ISAO I（3） TAKEO Y（3）
YOSHINOBU T（3） LU J（2）
公开年 2022（5） 2021（2）
申请年 2021（7）
专利权人 LINTEC CORP（3） LU J（2）

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Seed crystal adhesive used for seed crystal bonding, comprises adhesive and graphene.

HUANG X, ZHAO X, LUO Y, YANG M

Glass fiber cloth reinforced thermosetting copper-clad plate comprises glass fiber cloth, and copper foil bonded with resin adhesive on one or both sides of glass fiber cloth, the resin adhesive is formed by mixing adhesive and flame retardant and surface of copper foil is coated by coating.

CHEN M, WANG L, HE W, ZHAN H

Positive temperature coefficient heating body packaging structure; graphene conductive adhesive used in packaging structure comprises e.g. far-infrared emitting agent, copper powder, and high temperature resistant high molecular materials.

LU J

Graphene conductive adhesive for bonding positive temperature coefficient (PTC) heating sheet, comprises far-infrared emitter, graphene, copper powder and high-temperature resistant polymer materials, where high-temperature resistant polymer material contains high-temperature resistant glue.

LU J