国家/地区 中国（18） 美国（3） 世界知识产权组织（3） 欧洲专利局（EPO）（2） 台湾（2）
IPC部 C（18）
IPC大类 C08（18）
IPC小类 C08G（18）
IPC C09J009/02（18）
发明人 WANG Y（3） XU X（3） CHEN P（2）
CHEN Y（2） DENG X（2） HENCKENS A（2）
LI H（2） LI J（2） LIU J（2）
LIU Y（2） WU X（2） ZHA Y（2）
ZHANG Y（2）
公开年 2020（4） 2021（4） 2022（4） 2015（2） 2023（2）
申请年 2020（4）  2014（3）  2019（3）  2022（3）  2021（2）  2023（2） 
专利权人 CHANGZHOU SH.（2） HENKEL AG C.（2） UNIV ANHUI（2）

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Conductive adhesive useful in IGBT module chip, comprises lignin-based epoxy resin, modified graphene and curing agent; lignin-based epoxy resin is obtained by polymerization of hydroxylated lignin and epoxy resin, modified graphene is obtained by treating carbon materials with coupling agent.

LIAO G, DUAN J

Ultra-flexible high-efficiency radiating electromagnetic shielding adhesive tape for bonding electronic product parts, has graphene radiating layer comprising polyurethane resin, nano graphene sheet, filler particles and polymethyl urea resin.

WU Y, ZHANG Q

Preparing epoxy resin-based thermally conductive heat-resistant conductive adhesive film, comprises e.g. mixing epoxy resin and conductive accelerator evenly, grinding them thoroughly; adding silver powder, mixing well, vacuumizing, adding diluent, coupling agent and anti-aging agent and mixing.

QIAN L, CAO J, SONG T, WANG H

Modified silver-coated copper conductive powder epoxy conductive adhesive used as eutectic tin/palladium solder in electronic package, has bisphenol A epoxy resin, sheet-shaped silver coated copper conductive powder, spherical silver coated copper conductive powder, and nitrogen doped graphene.

GAO G, XIE J, YAN M, FAN W, CHEN P

Electrically conductive one-component epoxy adhesive composition for e.g. solar cell comprises epoxy resin, at least one ionic constituent as catalyst for epoxy homo-polymerization, electrically conductive particles, and inorganic particles.

POELLER S, WUCHERPFENNIG S, ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, STEINKOGLER S, ESTRUGAORTIGAMARQUE, POHL S

Electronic adhesive for packaging graphene-based semiconductor chips, comprises epoxy resin, reactive diluent, two-component curing agent, accelerator, coupling agent, aminated graphene oxide, one-dimensional carbon nanotubes, and composite powder comprising sheet and spherical silver powders.

WANG Y, LI H, ZHA Y, XU X, WU X, LIU J, DENG X

Weather-resistant high heat-conducting graphene based epoxy resin adhesive comprises epoxy resin, reaction diluent, double-component curing agent, accelerator, coupling agent, aminated graphene oxide and tin-bismuth alloy nano particles.

WANG Y, LI H, ZHA Y, XU X, WU X, LIU J, DENG X

Electroconductive composition used as interconnection material to connect solar cells into photovoltaic module, comprises silicone resin, silicone crosslinker, electroconductive particles, solvent, adhesion promoter, catalyst, and inhibitor.

HENCKENS A, THEUNISSEN E, YANG J, ZHANG Y, CHEN Y

New aniline compound used as bio-based alcohol-soluble self-healing electromagnetic shielding adhesive for sixth-generation electronic products.

LI N, YE L, LI J, WANG L, YIN P, LIN X, LIU Y, KANG D, GU F