国家/地区 美国（7）
IPC部 B（7）
IPC大类 B32（7）
IPC小类 B32B（7）
IPC B32B038/10（7）
发明人 GUO L（3） HAN S（3） LI X（3）
公开年 2013（2） 2014（2）
申请年 2012（5） 
专利权人 INT BUSINESS.（3）

Release of graphene layer from template substrate, for e.g. circuits, involves soaking graphene layer and template substrate in water such that water is intercalated between substrate and layer, and subjecting to delamination process.

BREMS S, HUYGHEBAERT C, VERGUTS K, DE GENDT S

Electrochemical etching method used for metal substrate involves forming electrically conductive polymer on graphene layer such that metal plate is coupled to graphene layer, then disposing metal substrate layer in electrolyte.

GUO L, HAN S, LI X

Electrochemical etching method for removing metal substrate layer from graphene layer, involves connecting graphene layer or metal substrate layer to power source to supply current to etch metal substrate layer from graphene layer.

HAN S, GUO L, LI X

Apparatus for electrochemical or electroplating etching of copper foils from graphene for e.g. electronic device application, has anode including metal substrate layer etched from graphene layer in response to current flowing through anode.

HAN S, GUO L, LI X

Method for transferring graphene on substrate used in electronic device, involves depositing graphene on side of metal substrate, and stacking target substrate on metal substrate-graphene layer to form stacked structure.

GONG K

Copper foil for manufacturing graphene, has specified arithmetic mean roughness in rolling parallel direction and rolling perpendicular direction.

CHIBA YOSHIHIRO, CHIBA Y, CHIBA G, YOSHIHIRO C

Method for non-destructively transferring graphene, involves nondestructively combining graphene coated with media with target substrate, and removing media to transfer graphene to target substrate nondestructively.

REN W, GAO L, MA L, CHENG H