国家/地区 世界知识产权组织（13）
IPC部 C（13）
IPC大类 C08（13）
IPC小类 C08K（13）
IPC C08K003/04（13）
发明人 HASEGAWA S（2） HASEGAWA SHOJI（2） KAMIYA N（2）
KAMIYA NAGISA（2） NAGISA K（2） SHEN Y（2）
SHOJI H（2）
公开年 2015（3） 2021（2） 2022（2） 2023（2）
申请年 2019（3）  2021（3）  2014（2）  2015（2） 
专利权人 GRAPHENE PLA.（2） GRAPHENE PLA.（2）

Heating pad in heatable garment, comprises graphene particles dispersed in polymer matrix material, and electrically insulating covering layer bonded to heating pad and electrically insulating covering layer, overlaying and bonded to heating pad.

JONES E O, HOWE T H, SEYMOUR J

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Carbogenic nanoparticle-conducting polymer composite ink for thin film coated printed circuit board, dispersed in water, where carbogenic nanoparticle is reduced graphene oxide, and composite ink includes e.g. graphene oxide-polypyrrole composite ink and carbon quantum dots-polyaniline composite ink.

BHATTACHARJEE L, SHARMA A, MANNA U, GOEL A, PAL B, BESSEMER C

Method for producing elastic heat spreader film, involves combing graphene sheets with rubber or elastomer to form elastomer/rubber-impregnated aggregate/cluster of multiple oriented/aligned graphene sheets.

LIN Y, JANG B Z, JEAN B, ZHANG B

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

Graphite-based carbon material used as graphene precursor for preparing graphene dispersion, comprises rhombohedral graphite layer and hexagonal graphite layer, and has specified rate calculated based on X-ray diffraction method.

HASEGAWA S, KAMIYA N, HASEGAWA SHOJI, KAMIYA NAGISA, SHOJI H, NAGISA K, SHEN Y