国家/地区 中国（6） 美国（6） 世界知识产权组织（5） 德国（4） 台湾（2）
IPC部 C（10）
IPC大类 C01（10）
IPC小类 C01B（10）
IPC C01B032/182（10）
发明人 ATIAS B（3） LEVI A（3） MENTOVICH E（3）
NAVEH D（3） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） LIPP E（2） ROTEM Y（2）
SUN Y（2）
公开年 2022（6） 2023（4）
申请年 2022（10）
专利权人 MELLANOX TEC.（3） UNIV BARILAN（3） PCB TECHNOLO.（2）

Manufacture of laminated graphene-based thermally conductive film used for electronic assembly, involves providing laminated film comprising graphene film layers separated by adhesive and comprising graphene sheets aligned with plane of graphene film.

LIU J, LAUBECK T

Graphene absorbing composite material i.e. wave absorbing material, for use in electronic technologies e.g. mobile devices, has nickel and/or cobalt formed as square-shaped structure and uniformly stacked on graphene sheet layer.

CHEN C, WANG X, CHEN G, FENG Y, CHEN Q, WANG Y, SU Y, LU S, ZHANG J, SUN Y, ZHANG P, HOU M, CHENG S, CHEN A, DU Z, MA Y

Monolithic heat sink used in led chips for e.g. electronic devices and electronic coolers, comprises hybrid composite structured dense base of aluminum alloy, graphene in plate form and copper in cylindrical form, and foamed fin.

GURBUZ M, SUNGUR B

Article e.g. rear window for motor vehicle comprises substrate and resistive heating element containing graphene, carbon nanostructure (CNS) material different from graphene, and glass frit, and graphene and CNS material containing adhesion promoter.

DELLOCK P K, KIZILTAS A, SALTER S, GLICKMAN D B, BOETTGER T F, BERTGE T F

Method for maintaining temperature adaptability by terminal, involves analyzing temperature information of collected screen, and controlling heating device to heat according to analysis result and conducting heat to screen through graphene radiating material layer and eccentric heat pipe shaft.

QI Y, SUN Y, QIN X

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Upper electrode assembly used in plasma processing apparatus, has heat transfer sheet that is mounted between electrode plate and metal plate and having vertically oriented portion with vertically oriented graphene structures.

TSUJIMOTO H, KOBUNE T, LI L, LEE L, KOBUNEDAKAKI

Plasma enhanced chemical vapor deposition method used in semiconductor structure, comprises turning on radio frequency source of radio frequency system to decompose aromatic hydrocarbon precursor into multiple active radicals at specific frequency to form graphene layer on magnetic layer.

WU Z, NI I, XU Y, HUANG J, WU C, HSU Y, HUANG J Z, HSU Y H