国家/地区 中国（8）
IPC部 B（8）
IPC大类 B22（8） C01（8） C22（8）
B33（2） C23（2） H01（2）
IPC小类 B22F（8）
IPC C22C001/05（8）
发明人 ZHANG Q（2）
公开年 2022（6） 2023（2）
申请年 2022（8）
专利权人 UNIV XIAN TE.（2）

Preparing in-situ self-generating germanium tungsten carbide synergistic reinforced tungsten copper composite material, involves mixing copper powder, micro-activating element and alcohol, pressing, calcining porous tungsten skeleton and performing infiltration sintering porous tungsten skeleton.

LIANG S, XIAO P, ZOU J, YANG B, DENG N, CHEN Z, YANG J, ZHANG Q

Method for performing metallization process in surface of graphene metal-based composite material used in e.g aerospace, involves adding reducing agent for fully stirring, separating, water washing and drying to obtain surface metallization of graphene powder.

HU Y, ZHANG Q, LI Q

Method for preparing graphene metal composite material useful in field of alloy preparation for electrical, mechanical, and thermodynamic applications, comprises e.g. growing graphene on surface of metal material, heating, and applying pressure to metal material grown with graphene.

QU Y, TAN H, WANG W, SHEN D

Aluminum material with superconducting heat performance used in electric appliance device, comprises coating heat conducting material and curing agent on surface of aluminum alloy, drying and curing to obtain super-conductive aluminum material.

CHEN M

Preparing graphene-reinforced aluminum matrix composite by metal 3D printing, comprises taking graphene powder, graphite powder, polyvinyl alcohol and solvent into cleaning ball mill, vacuumizing, ball milling, drying and filtering.

CHEN S, QIU H, WU J, CHEN B

Preparing graphene metal matrix composite material, comprises carrying out surface metallization of graphene by molecular-level engineering treatment, and configuring certain proportion of organic solvent to mix metallized graphene and metal nanoparticles into paste for sintering.

ZHONG A, ZENG S, ZHANG X, ZHANG K

Preparation of in-situ self-generated graphene/copper composite material with composite interface structure, used for e.g. large-scale integrated circuit lead, comprises heating raw material copper in air, soaking in formic acid, drying, and heating and carbonizing treatment.

ZHANG L, SHENG J, WANG L, FEI W

Graphene-enhanced copper-molybdenum composite material with three-dimensional network structure used in e.g. high voltage switch, microelectronic package and instrument field, comprises copper, molybdenum, and reduced graphene oxide.

XU R, FEI Y, LI Z, WANG X