国家/地区 欧洲专利局（EPO）（5） 美国（5） 中国（3） 韩国（3） 印度（2） 日本（2） 世界知识产权组织（2）
IPC部 C（8）
IPC大类 C09（8）
IPC小类 C09D（8）
IPC C09D007/40（8）
发明人 PARK J（2）
公开年 2021（6）
申请年 2019（3）  2021（2） 
专利权人

Heating apparatus like stoves, comprises body, chamber defined by body, where chamber comprises upper region and lower region, and thermal plate that provides heat to chamber, where thermal plate comprises coating having thermo-resistive layer comprising polymeric portion and nanostructure portion.

KHIZAR M, FRACCON S

Invisible ice-covering-proof compatible material useful as surface material of equipment, comprises insulating and heat insulating layer comprises e.g. polyimide, glass fiber, hollow glass microsphere and/or polyurethane and patterned heating, insulating heat conducting and hydrophobic layer.

MA Z, ZHAN X, WANG Z, ZHAO Z, ZHU Y, CHEN J, LIU X, CHEN H

Preparing heat dissipation paint by inserting linear carbon nanomaterial between planar carbon nanomaterial layers, adding and mixing solvent to carbon nanomaterial, dispersing by adding dispersant, and dispersing first dispersed mixture.

PARK J

Electromagnetic wave shielding coating method for steel materials comprises surface treatment of surface-treating contaminants including rust, dust, and oil on surface of steel material using surface treatment device.

PARK J

Coating composition used for a coated substrate comprises a polymer material comprising an electrically conductive polymer, and a coated or partially coated magnetic material comprising a magnetic material and antioxidant material.

KINLEN P J

Heatable glass fiber fleece for glass fiber fleece component for heating floor, wall and/or ceiling, comprises coating containing conductive additive(s) and binder(s), and has specified weight per unit area.

SCHUETZ W, KREMER M, FORERO S, TROLL C, SCHUETZ M, JEHNES S, BENRA J

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A