国家/地区 美国（3） 中国（2） 欧洲专利局（EPO）（2） 韩国（2） 波兰（2）
IPC部 C（6）
IPC大类 C09（6） H01（6） B82（3）
C08（2） H05（2）
IPC小类 C09D（6）
IPC H01L023/00（6）
发明人 DABROWSKA TUMANSKA.（2） DABROWSKATUMANSKA E（2） MALAG A（2）
TEODORCZYK M（2）
公开年 2022（3） 2014（2）
申请年 2014（3）  2022（2） 
专利权人 MATERIALOW E.（2）

Preparing composite nano-coating material used in chip, involves using graphene nanosheet, soluble iron salt, soluble nickel salt and concentrated alkali as raw material, precipitating iron and nickel element on surface of graphene nanosheet in form of hydroxide by co-precipitation method.

ZHENG T, LI M, MAO J, JIN Y

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Resin composition used for forming adhesive film for forming dicing die-bonding film, comprises polymer substrate comprising curing agent and (meth)acrylate-based resin, and magnetic filler comprising core and coating layer containing yttrium oxide and ferrite.

JANG J M, JU L K, SUN Y, SUN Y L, LEE K J

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Making spacer-graphene heat-spreader in electronic power devices (laser diodes), comprises depositing a suspension comprising graphene nanoplatelets in Butyl carbitol acetate on radiator of semiconductor laser cooler and drying.

DABROWSKA TUMANSKA E, JAKUBOWSKA M, MALAG A, MLOZNIAK A, TEODORCZYK M, DABROWSKATUMANSKA E

Thermal resistance reduction in electronic power devices, preferably in laser diodes, involves deposition aqueous suspension of graphene oxide to cooler of semiconductor laser, and drying obtained layer at room temperature.

DABROWSKA TUMANSKA E, LIPINSKA L, MALAG A, TEODORCZYK M, WILINSKI Z, DABROWSKATUMANSKA E