国家/地区 中国（38）
IPC部 C（38）
IPC大类 C22（38） C23（15） C21（11）
B22（9） C25（9） C01（7）
B21（6） H01（6） C30（4）
B32（3） B82（3） B23（2）
C09（2）
IPC小类 C22F（38）
IPC C22F001/02（38）
发明人 WANG X（7） LI J（4） LIU K（4）
LIU Q（3） WANG E（3） CAO Z（2）
CHIBA G（2） CHIBA Y（2） DING Z（2）
HE M（2） HE Z（2） HOU H（2）
HU X（2） HUANG Z（2） LI T（2）
公开年 2021（14） 2020（6） 2022（6） 2023（4） 2017（3）
申请年 2021（12）  2022（8）  2020（6）  2019（4）  2012（2）  2016（2）  2017（2）  2018（2） 
专利权人 SONGSHAN LAK.（3） AVIC MFG TEC.（2） BEIJING GRAP.（2） HARBIN INST .（2）
JX NIPPON MI.（2） NIPPON MININ.（2） NIPPON MININ.（2） UNIV HENAN S.（2）
UNIV NANCHAN.（2） ZHONGKE JING.（2）

Preparing graphene copper-based composite material, comprises e.g. mixing graphene slurry and copper-based powder, compressing powder to obtain green body, vacuum calcining, subjecting to solution heat treatment and aging heat treatment to obtain graphene copper-based composite material.

WANG X, XIAO Z, CAO Z, LI J

Soluble aluminum alloy useful for underground restrictor component, comprises gallium, tin, lead, copper, titanium, yttrium, silicon, nickel, tungsten carbide, fiber-shaped graphene, plated lanthanum oxide-copper modified basalt fiber, and aluminum.

ZHAO B, SONG H, ZHAO Z, WEI Y, BAI X, LIU S, XIAO S, YANG X, XIE Y, WANG X

Preparing graphene-doped copper bonding wire comprises taking graphene oxide, mixing with mixed metal powder to obtain molten mixed powder, placing semi-finished product wire into aqueous solution of reducing agent for heating, annealing, washing and drying.

FENG Z, QU S, LIU B, WANG T, LIN L

Preparing rGO/silicon dioxide coating on aluminum-magnesium-silicon alloy plate surface, comprises selecting polar plate, using computer engraving technology to engrave single-channel snake-shaped flow field, and removing oil and impurity.

SHAO C, HUANG J, YUAN B, LIU J, ZHANG L

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z

Preparing copper-based graphene composite material comprises growing graphene film on surface of copper foil by chemical vapor deposition, stacking, using ultrasonic welding technology to weld stacked components, and removing stress and annealing welded stack assembly.

WANG E, WANG X, HE M, ZHANG R, ZHAO C, HU X, LIU K, FU Y

Preparing fine-grained high-purity oxygen-free copper plate comprises e.g. cleaning hearth of electron beam cooling bed smelting furnace, heating hot-pressed slab, milling milled hot-rolled billet up and down, annealing semi-finished sheet material, and cutting according to product shape.

WANG W, WANG C, LIU X, LIU Q, ZHOU B, WANG J, SUN J, LIANG X, WANG Q

Mining hydraulic support repairing device, has adjusting mechanism comprising two sliding groove plates symmetrically and uniformly distributed and fixedly installed on top surface of bottom plate.

XIE S, SHAO H, JIAO G, ZHANG H, LI X

Preparing single crystal graphite comprises e.g. placing metal foil in plasma device, introducing nitrogen-containing gas, starting plasma excitation source for plasma treatment, placing metal foil in reaction furnace, annealing, starting growth of graphene single crystal at growth temperature.

ZHAO M, LI G, WANG B, WEI W, XU X, GUO Y, LI J, JIAN X, QUE L, ZHOU Z

Preparing copper-chromium-zirconium alloy layered belt material with composite deformation of graphene/copper, involves subjecting bulk copper-chromium-zirconium alloy to solid solution treatment, carrying out room temperature iso-channel extruding, low temperature rolling, stacking and vacuum-aging.

WANG D, AN X, DU Q, WEI K, YAO L, WEI W