国家/地区 中国（7） 世界知识产权组织（4） 美国（3） 德国（2） 台湾（2）
IPC部 B（12）
IPC大类 B32（12） C01（7） C09（4）
H01（4） C23（3） H05（3）
IPC小类 B32B（12）
IPC B32B015/04（12）
发明人 ATIAS B（2） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） LEVI A（2） LI Y（2）
LIPP E（2） MENTOVICH E（2） NAVEH D（2）
ROTEM Y（2）
公开年 2022（12）
申请年 2022（7）  2021（3）  2020（2） 
专利权人 MELLANOX TEC.（2） PCB TECHNOLO.（2） UNIV BARILAN（2）

High-efficiency radiating coating color plate comprises substrate, first chemical processing layer and second chemical processing layer respectively located on two sides of substrate, thermal bonding layer and film layer located on first chemical processing layer.

ZHAO J, ZHOU T, CHEN T, ZHAO X

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Preparing graphene copper composite material useful in supercapacitors and motor drive devices, comprises e.g. pre-setting multi-layer copper foil in hot pressing chamber, adopting chemical vapor deposition, preparing graphene film on copper foil surface, and sintering graphene-copper.

GONG M, ZHAO M, LI M, CHEN C, CHEN Q, YANG W, LI Y, WANG Y, LIU B, PEI Z, ZHANG X, LIANG J

Laminate used for electronic device such as display device, comprises substrate, layer containing compound having condensed polycyclic hydrocarbon structure, and layer containing conductive material.

NAOYA N, KAZUNORI T, NOSAKA N, TAKANASHI K

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Preparing high thermal conductivity thick film of large-scale graphene interface involves adding natural flake graphite in the reaction unit that vitriol oil is housed, stirring, mixing uniformly, and adding oxidizing agent and oxidizing agent.

PANG K, LIU Y, XU Z

Producing graphene metal layered complex material useful in e.g. aviation and space comprises stacking number of metal base material separated by interlayer material in sealing chamber, growing graphene on metal base material, stacking graphene metal complex materials, and hot pressing.

SHAO L, DUAN Y, SHI H, LI Z, ZHANG Y

Preparing impact-resistant and oil-fouling composite board comprises e.g. foaming aluminum preparation, nano powder preparation, spinning solution preparation, weaving base fabric, modified base fabric preparation, sheet preparation and finishing product.

GE B

Anti-corrosive metal housing for electronic device has metal substrate, passivation layer including oxyanion e.g. molybdate, vanadate, and/or manganese salt, and sealing layer including e.g. sodium silicate, zinc powder, and/or clay powder.

LI Y, CHUANG Y C, WU K