国家/地区 台湾（19）
IPC部 C（19）
IPC大类 C09（19） H01（14） C08（10）
H05（6） B32（5） C01（3）
G02（2）
IPC小类 C09J（19）
IPC C09J011/04（11） C09J009/02（6） C09J133/08（6）
C09J011/06（5） C09J163/00（5） C08K003/04（4）
H01M004/62（4） H01M010/0525（4） C09J011/08（3）
C09J201/00（3） H01L023/373（3） H01L031/05（3）
H01M004/36（3） H05K007/20（3） B32B007/02（2）
发明人 HENCKENS A（3） ICHIKAWA I（3） ISAO I（3）
TAKEO Y（3） YOSHINOBU T（3） ESTRUGA O M（2）
ESTRUGA ORTIGA M（2） ESTRUGAORTIGAMARQUE（2） ZHANG Y（2）
公开年 2022（10） 2021（4） 2014（2）
申请年 2021（8）  2020（4） 
专利权人 HENKEL AG C.（3） LINTEC CORP（3）

Fluoropolymer binder for lithium-ion battery, comprises mixture of phase of polytetrafluoroethylene formed of primary polytetrafluoroethylene particles and phase of polyvinylidene fluoride formed of primary polyvinylidene fluoride particles.

BONNET A, FINE T

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

New siloxane-imide copolymer used in addition curable silicone-imide composition for cured silicone-imide material incorporated in an aerospace, electronic, automobile, insulation, coating, or solvent resistant membrane application.

NARAYANAN R, SUNAGA T, FUJIMOTO T, MANDAL S

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Dispersion optical composition for e.g., polymer film and polymer portion comprises a filler comprising particles, a polymerizable monomer or oligomer, and an additive.

HERB C A, MILLER D D, BZOWEJ E, MCCULLOUGH L A, MCCULLOUGH L, MILLER D, HERB C

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Resin composition used for forming adhesive film for forming dicing die-bonding film, comprises polymer substrate comprising curing agent and (meth)acrylate-based resin, and magnetic filler comprising core and coating layer containing yttrium oxide and ferrite.

JANG J M, JU L K, SUN Y, SUN Y L, LEE K J

Electrically conductive one-component epoxy adhesive composition for e.g. solar cell comprises epoxy resin, at least one ionic constituent as catalyst for epoxy homo-polymerization, electrically conductive particles, and inorganic particles.

POELLER S, WUCHERPFENNIG S, ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, STEINKOGLER S, ESTRUGAORTIGAMARQUE, POHL S