国家/地区 韩国（10）
IPC部 C（10）
IPC大类 C08（10） C09（8） F21（5）
F28（3） H05（3） B29（2）
B32（2） H01（2）
IPC小类 C08K（10）
IPC C08K003/04（5） C08K003/38（3） C08K007/06（3）
C09D007/61（3） C09K005/14（3） F21V029/85（3）
F21V029/87（3） H05K007/20（3） C08K009/04（2）
C08L101/00（2） C09D005/18（2） C09D007/62（2）
C09D163/00（2） C09D201/00（2）
发明人 KIM S W（2） LI Z（2） LIM J J（2）
公开年 2021（10）
申请年 2020（4）  2021（4）  2019（2） 
专利权人 AMOGREENTECH.（2） LASER LIGHTI.（2）

Ice maker used for artificially making large amount of ice at home and in business, comprises forming ice-making space for generating ice, tray in which conductive material forms electrical network and power terminal to supply power to tray.

SHIN D S, HONG C W

Cooling structure used for cooling article, comprises infrared ray and UV ray absorption and emission layer comprising polymer matrix and conversion material comprising nanoparticles of core-shell structure including core formed of semiconductor material and shell, and visible light reflective layer.

OH S J, LEEHEON, JEON S, SONSUMIN

Paint composition having excellent heat dissipation effect useful for producing light-emitting diode lighting fixture, comprises aluminum nitride powder, epoxy resin, boron nitride powder, photoinitiator and conductive material.

KIM S W, LIM J J

Lighting fixture e.g. lamp, is applied with heat dissipation composition comprising polymer resin, dispersion stabilizer and thermally conductive filler, which is surface-modified with silane coupling agent after coating with agarose.

SHIN J, SHIM S E

Heat dissipation paint composition for preparing LED lighting fixture comprises boron nitride powder pretreated with ammonia plasma and an epoxy resin.

KIM S W, LIM J J

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Light emitting diode headlamp module for automobiles, consists of metal plate for supporting lamp, and heat dissipation case formed of heat-resistant plastic, and comprising region accommodating metal plate, and region having protrusion.

LEE H K

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y