国家/地区 中国（18）
IPC部 C（19）
IPC大类 C08（19） H05（12） H01（7）
C09（6） B32（3）
IPC小类 C08L（19） C08J（14） C08K（14）
H05K（11） C08G（5） C09D（5）
H01B（4） B32B（3）
IPC C08L079/08（19）
发明人 CHEN K（3） YU D（3） LI C（2）
LI X（2） WANG Y（2） ZHOU J（2）
ZOU H（2）
公开年 2022（19）
申请年 2022（11）  2021（5）  2020（3） 
专利权人 ITEQ WUXI EL.（3）

Preparing boron-doped fluorinated polyimide film used in supercapacitor, involves obtaining polyimide by weighing certain amount of diamine, and four organic solvent and adding into mouth flask, stirring at normal temperature to diamine to dissolve, and weighing certain mass of dianhydride.

LI X

Liquid crystal polymer single-sided copper clad laminate useful in technical field of preparing copper-clad laminates, comprises LCP mixture layer and copper foil layer sequentially from top to bottom.

WANG Y, LIU C, XU S

Shell useful for sounding device and electronic device, comprises microcellular foam shell part (engineering plastic materials).

LI C, WANG T, ZHOU H

Preparing high thermal conductivity electromagnetic shielding polyimide co-carbonized carbon fiber complex material useful in military, comprises e.g. preparing modified polyamic acid spinning fiber felt, immersing in high-performance resin, and post-processing.

LI X, DING P

Optical film with low haze useful in vehicle-mounted display product manufacturing field e.g. wearable device, comprises e.g. substrate layer comprising first optical surface and second optical surface, and flatness adjusting layer arranged on first optical surface and/or second optical surface.

JU J, LIU J, XU J

Preparing long-life flexible circuit board comprises adding dimethyl sulfoxide into stirring tank, coating mixed solution on template by casting coating film, soaking in imidization solution, and utilizing punching device for punching and slicing flexible circuit board after curing.

CHEN Y, LU D, WU A, HU X, ZHOU J

Preparing aerogel with electromagnetic shielding and sound absorption functions useful in aerospace fields in complex environments, comprises e.g. preparing aramid nanofiber dispersion liquid, preparing polyimide precursor polyamic acid, dissolving in deionized water, and mixing conductive filler.

YAO J, YANG F, ZHOU J

Preparing flexible cable used as electric energy or signal transmission device, involves spraying polymer microsphere on cable core, modifying modified graphene oxide, N,N'-(4,4'-methylene diphenyl)bismaleimide, coating sheath material on surface of irradiated cable core and rolling.

LUO X

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D