国家/地区 日本（17）
IPC部 B（17）
IPC大类 B32（17）
IPC小类 B32B（17） C01B（14） C23C（7）
B82Y（6） H01L（5） C04B（4）
H01B（3） B05D（2） B22D（2）
C09K（2） C30B（2） H05K（2）
IPC B32B015/04（17）
发明人 MAEKAWA T（2） TAKASHI M（2）
公开年 2011（4） 2013（4） 2021（2）
申请年 2010（3）  2021（3）  2011（2）  2013（2）  2014（2） 
专利权人 MITSUBISHI M.（3）

Heat dissipation component used for e.g. battery, comprises substrate comprising metal, and composite material comprising multilayer graphene layer in which two or more layers of graphene are laminated, and amorphous carbon wall portion adhered to graphene layer in circumferential direction.

WATANABE J

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Graphene bonded body having structure comprises graphene-containing carbonaceous member containing graphene aggregate and member to be joined, junction interface, active metal compound layer formed on member, and tin-concentrated layer.

TOYO O, OHASHI T

Composite heat transfer component used for e.g. power module, comprises plate composed of carbonaceous material comprising composite containing graphene aggregates and graphite particles, and cast metal component that covers plate surface.

MAEKAWA T, YAMASHIMA S, TAKASHI M, SUSUMU Y

Graphene oxide structure used for e.g. electronic apparatus, has preset peak area obtained by adding peak area of peak derived from bond between carbon and hydrogen and peak area of peak derived from bond between carbon and carbon.

WATANABE M, HATAKEYAMA K, KOINUMA M

Formation of graphene scroll for synthesizing graphene article, involves annealing catalyst substrate in hydrogen gas, exposing substrate to reaction gas mixture, detaching substrate from graphene and consolidating synthesized graphene.

VLASSIOUK I V, IVANOV I N, DATSKOS P G

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Graphene layer-containing multilayer film used for electronic device component, has inorganic thin film, layer with oxygen-containing group, and resin layer with functional group which reacts with oxygen-containing group and forms bond.

TANAKA A

Manufacturing electrical conductor used in e.g. cables and printed circuit boards involves providing base substrate; providing foil; depositing graphene layer on foil to define layered structure; and depositing structure on base substrate.

MARTENS R I