国家/地区 中国（9） 世界知识产权组织（4） 美国（3）
IPC部 C（14）
IPC大类 C08（14）
IPC小类 C08G（14）
IPC C08J005/24（14）
发明人 LIU S（4） YUAN Y（4） ZHAO J（4）
MA Y（2）
公开年 2023（4） 2021（3） 2022（3） 2020（2）
申请年 2022（5）  2020（4）  2021（2） 
专利权人 UNIV SOUTH C.（4）

Composition used to produce thermoset composite material comprises cyanate ester comprising difunctional cyanate ester compound and polyfunctional cyanate ester moiety and substituted bisimide compound comprising biscitraconimide compounds.

LA DELFA G, FOURNIER J, ABGOTTSPON M, MAYERHOEFFER U, ELLINGER S

Preparing continuous fiber reinforced aromatic polyimide 3D printing thermal conductive composite material comprises e.g. impregnating continuous fiber filaments or tapes in aromatic polyimide prepolymer/thermal conductive filler, adjusting glue content and ribbon shape, curing resin.

LIU S, ZHAO J, LI L, YUAN Y

Polymer-nanocarbon composite used in article of manufacture and infrastructure applications, comprises nanocarbon material and polymer comprising aromatic hydrocarbon moieties and/or aromatic heterocyclic moieties.

BURNS A B, ZHOU H, ALTINTAS O, PATIL A O, NATARAJAN B

Amine composition used in epoxy system for producing structural or electrical laminates, coatings, castings, structural components, circuit boards, electrical varnishes, encapsulants, and semiconductors, comprises alkylated diamine, tertiary amine and polyoxyalkyleneamine.

PENG Q, LI S

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Preparing continuous fiber-reinforced thermosetting resin-based composite material having high thermal conductivity, comprises e.g. dispersing epoxy prepolymer, curing agent, catalyst, thermally conductive filler and solvent, impregnating continuous fibers, then hot-pressing.

ZHAO J, LIU S, WANG Z, YUAN Y

Preparation of discontinuous fiber-reinforced polyhexahydrotriazine resin-based thermally-conductive composite material involves prepolymerizing formaldehyde and aromatic amine, mixing with discontinuous fibers to obtain prepreg, and curing.

YUAN Y, MA Y, ZHAO J, LIU S

Preparing continuous fiber reinforced polyhexahydrotriazine resin-based thermally conductive composite material e.g. comprises dissolving formaldehyde and aromatic amine in water/non-proton solvent mixed solution and then pre-polymerizing.

YUAN Y, MA Y, ZHAO J, LIU S

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M