国家/地区 中国（9）
IPC部 C（9）
IPC大类 C08（9）
IPC小类 C08K（9） C08L（9） C08J（4）
C08G（2） C09K（2）
IPC C08K003/04（9）
发明人 LI H（9）
公开年 2022（3） 2023（2）
申请年 2022（3）  2021（2） 
专利权人 GUANGDONG SU.（2）

Self-adhesive heat-conducting silicon gel, comprises raw material as polyethylene glycol, modified heat-conducting filler, dimethyl silicone oil and dimethicone coupling agent.

REN B, ZENG X, ZHANG M, JIN L, LI H, LIU H, CHENG X, WU X

Acrylic foam useful in an electronic device, comprises foam layer arranged on upper surface of substrate layer, protective layer arranged on upper surface of foam layer, where foam layer comprises aqueous acrylic resin emulsion, foam stabilizer, crosslinking agent, and other additives.

WU P, PAN F, LI H, WANG H, YANG Y, REN Z, ZHANG S, LIAO X

Wave-absorbing heat-conducting gasket useful in thermal interface material and electronic equipment, prepared into aerogel by constructing three-dimensional thermal conduction path by directional freezing of liquid nitrogen and prepared by pouring liquid silicone rubber.

LI H, DONG B

High temperature resistant dispersant useful for protection treatment of surface of film substrate, comprises e.g. siloxane-containing polymer micro-gel dispersion, and coupling agent modified inorganic nano-sheet dispersion.

LI H

Production of modified hexagonal boron nitride powder used for preparing radiating film, involves mixing oxidant and hexagonal boron nitride, heating, adding pre-treated boron nitride, reacting with e.g. modifier and hydroxylated boron nitride, centrifuging, filtering, drying and crushing.

PAN F, LI H, ZHANG S, WU P, WANG H, YANG Y, LIAO X, REN Z

Silica gel composite material comprises MXene material, h-boron nitride material, single-layer graphene powder, urea, and silica gel.

LI H, GUO C

Fiber resin material comprises carbon fiber, organic resin, graphene and modified additive.

LI H

Boron nitride-coated sulfonated graphene-epoxy resin composite material for electronic packaging materials, comprises epoxy resin powder, boron nitride powder, sulfonated graphene powder, silane coupling agents, and polyamide curing agent.

CHEN Q, DING X, NI R, DUAN M, LI H

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y