国家/地区 中国（80） 世界知识产权组织（7） 美国（6） 韩国（4）
IPC部 C（86）
IPC大类 C08（86）
IPC小类 C08K（86） C08L（80） C08J（33）
C09K（24） C08G（11） B32B（6）
B29B（5） B29C（5） D01F（4）
C01B（3） C08F（3） H01B（3）
B82Y（2） C09C（2） C09D（2）
IPC C08K003/38（86）
发明人 LI Y（6） YUAN Y（5） ZHANG Y（5）
WANG Z（4） ZHENG Y（4） CHEN Z（3）
DING L（3） FU W（3） HE D（3）
HU Q（3） LI J（3） LI Z（3）
LIU S（3） LIU X（3） MA Y（3）
公开年 2021（61） 2020（19） 2022（6）
申请年 2020（86）
专利权人 SHENHUA TECH.（3） UNIV SICHUAN（3） UNIV SOUTH C.（3） 3M INNOVATIV.（2）
BOMAN MEDICA.（2） CGN ADVANCED.（2） CHINESE ACAD.（2） WUXI DEYU NE.（2）

Composite material useful as structural material and coating layer material applied to parts of electronic devices, comprises surface-modified inorganic compound and polymer resin matrix which is mixed with inorganic compound.

SHIN C M

Polyvinyl chloride cable material useful for electric wire cable product, comprises polyvinyl chloride resin, filler, oil-resistant rubber, plasticizer A33, heat stabilizer, antioxidant, lubricant and flame retardant, colorant and graphene slurry.

ZHANG J, WANG G, XIA Q, FENG G, ZHANG Y

Insulating heat-conducting composite material used in electronic device, comprises thermally conductive concentrated master batch comprising thermoplastic elastomer, inorganic and carbon-based heat conducting filler , and polyamide 66 resin and auxiliary agent.

LI J, LI X, LIU T, YI W, ZHAO L, WANG H, ZHANG M

Thermally conductive gasket used in electronic device, has adjacent thermally conductive fillers in direct contact to form a three-dimensional thermally conductive network containing internal voids and inner voids of three-dimensional thermally conductive network filled with high molecular polymers.

JIANG N, LIN Z, CHU W, DAI W, LI M, YU J

Weather-resistant and heat-insulating polycarbonate (PC)/polymethyl acrylate (PMMA) composites used for buildings comprises polycarbonate, poly(methyl methacrylate), composite toughening agent, compound compatibilizer, chain extender, coupling agent, nano antimony doped tin dioxide.

YAO W, HUANG W, JIA F, KONG J, WU Z

Heat-conducting halogen-free flame retardant polyolefin composite material for automobile electric module comprises polypropylene, polyethylene, halogen free fire retardant boron nitride, oxide, graphene, dispersant and lubricant.

SONG W, LIANG N, SHAO L, WANG H, YANG G

Preparing polymer composite involves dispersing nanosheet filler within polymer matrix by dissolving monomer in water to form first solution, dispersing nanosheet filler in organic solvent in the presence of emulsifying agent.

MICHAEL F M, ALSHARAEH E, ALMOHSIN A

Insulating and thermally conductive polymer complex material useful in e.g. aerospace, military or electronic information fields comprises thermally conductive filler, which complex with benzoxazole polymer nanofibers through pi-pi action.

YANG X, LI R, XU J, ZHAO N

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Heat-dissipating composition used for forming polymer composite, comprises base resin, and boron nitride which is surface-modified by pi-pi stacked benzoic acid, large boron nitride and small boron nitride, and has preset thermal conductivity and tensile strength.

LEE G, MIN K J