国家/地区 日本（7）
IPC部 C（7） H（4）
IPC大类 C08（7）
IPC小类 C08K（7） C08L（5） C01B（4）
H01L（2）
IPC C08K003/38（7）
发明人 ITO G（3） ZAIMA H（3） ANDO A（2）
SUGIMORI S（2）
公开年 2022（3） 2021（2）
申请年 2021（5） 
专利权人 KRI INC（2） TOYO INK SC .（2）

Magnetic field responsive hexagonal boron nitride particles comprises hexagonal boron nitride particle that responds to magnetic field, which has adsorption layer of monolayer of graphene oxide or partially reduced oxide on surface of scale-like or plate-like hexagonal boron nitride particle.

ZAIMA H, MATSUMOTO N, SUGIMORI S, ONAKA N J, ITO G

Surface modified hexagonal boron nitride particles used for thermally conductive resin composition, have partially reduced graphene oxide adsorption layer on surface of untreated hexagonal boron nitride particle.

ZAIMA H, SUGIMORI S, ONAKA J, ITO G

Conductive composition used for forming conductive film used for applications such as conductive wiring, antenna materials for radio frequency identification, electromagnetic wave shielding materials, and materials for sensors, comprises binder resin and boron-containing carbon material.

NAKASONE D, KAWAHARA J, ANDO A

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Boron-containing carbon material used in resin composition used for forming conductive film, comprises elemental boron which is doped so as to replace part of elemental carbon in carbon skeleton, where carbon material has specific content of boron element.

ANDO A, MOROISHI Y, MIYAFUSA Y, WATANABE H

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Heat conductive resin composition used as sealing material and packaging material, comprises resin, and filler having thermal conductivity dispersed in resin, where filler comprises graphene oxide-coated aluminum oxide particles.

TSUKADA Y, ITO Y, MIZUTA Y, KIBA S, ZAIMA H, ITO G, NISHIURA K