国家/地区 中国（13） 韩国（3） 世界知识产权组织（3） 台湾（2）
IPC部 C（18）
IPC大类 C08（18）
IPC小类 C08L（18）
IPC C08L063/00（18）
发明人 LIU L（3） CHEN Z（2） LI W（2）
公开年 2021（4） 2022（4） 2020（3） 2017（2） 2023（2）
申请年 2020（5）  2021（5） 
专利权人

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Preparing thermally conductive adhesive used in power components involves mixing the matrix resin with the sheet-like thermally conductive filler, acoustic cavitation treatment and negative pressure treatment are carried out to obtain a rubber compound.

WANG B, LIU F, PAN H, XU W

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Wave absorbing glue film comprises wave absorbing layer one or two sides set with reinforcing layer outer side set with adhesive film layer outer side set with backing and absorbing layer film formed by mixing wave absorbing material and resin matrix.

ZHAO H, DU P, LI Y, LV T, LI M

Composition used for coating metal surface, comprises graphene and resin and has high thermal and electrical conductivity.

ZATTERA A J, VANZETTO A B, PIAZZA D, LIMA G G D, MAROCCO M V

Lignin derivative-based phosphorus-containing epoxy resin used for forming composite material for flame retardant materials, coatings, microelectronic packaging materials, and adhesives, comprises structures.

YANG W, DING H, MA P, XU P

Improving viscosity of sound insulation cotton comprises e.g. stacking anti-aging layer, mixed fiber layer, light metal mesh layer, soft resin layer and elastic layer, applying adhesive, compacting, and absorbing sound insulation cotton.

PAN J, WANG F

Electronic skin comprises e.g. encapsulation layer arranged on sensing layer, glue layer arranged on bottom of base layer and release paper arranged on glue layer, base layer and packaging layer are provided with heat dissipation layer.

JIANG Z, LI W