国家/地区 世界知识产权组织（44）
IPC部 C（44）
IPC大类 C08（44）
IPC小类 C08L（44） C08K（35） C08J（18）
C01B（11） C09K（8） B82Y（7）
C09D（7） H05K（6） B29C（4）
B32B（4） C08G（4） H01L（4）
C09J（3） C25D（3） H01B（3）
IPC C08L063/00（44）
发明人 CHEN Z（2） GAILLARD P（2） KORZHENKO A（2）
LEE E J（2） LEE K（2） LEE K D（2）
LI W（2） NAM C R（2） SEO M K（2）
SONG J（2） SONG J H（2） UCHIDA K（2）
公开年 2021（12） 2022（9） 2017（4） 2023（4） 2014（3） 2013（2） 2016（2） 2018（2）
申请年 2021（11）  2022（7）  2017（6）  2019（4）  2020（4）  2012（3）  2013（2） 
专利权人 ARAMCO SERVI.（2） ARKEMA FRANC.（2） HANSOL CHEM .（2） KYOCERA CORP（2）
SAUDI ARABIA.（2）

Electromagnetic interference suppressing material used as radio wave absorber, noise suppression sheet, semiconductor sealing material, sealing sheet, and wire coating material, comprises base material containing organic substances and inorganic substances, and powdered carbon material.

NISHIHARA H, YOSHIDA S, UCHIDA K

Composition used for forming coating material, comprises curable resin and/or its precursor, inorganic particles, and graphene having preset average thickness.

KATO T, TAMAKI E

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Synthesizing low-cost composite flexible graphite sheet for electromagnetic interference shielding, comprises dispersing carbon derivatives in ethanol, mixing epoxy resin and anhydride-based hardener, and curing the sheet.

BOSE S, SINGHAL A V, SAMANTARAY P K, SYKAM N, SHARMA A K, IMAM S A

Composite material used for fabricating load-bearing structures, comprises reinforcement fibers impregnated with thermoset resin composition comprising epoxy resin component, curative component comprising 4,4'-methylenebis(2,6-xylidine), and thermoplastic component.

RESTUCCIA C L

Glass or carbon fiber filled sheet molding compound (SMC) composition used to make vehicle part, comprises graphene for providing improved Izod impact strength, flexural strength and tensile properties over SMC composition without graphene.

ASTHANA S, PACHHA R

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T