国家/地区 中国（14）
IPC部 B（14） C（14） D（4）
H（2）
IPC大类 B32（14）
IPC小类 B32B（14）
IPC C08L063/00（14）
发明人 LIU Y（3） CHEN H（2） CHEN J（2）
HE H（2） WANG B（2） WU H（2）
YAO J（2）
公开年 2022（9） 2023（5）
申请年 2022（14）
专利权人 HUIZHOU ZHON.（2） JIANGSU YAO .（2）

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Preparing medicine packaging composite film with super peel strength used in medicine industry, by adding high-pressure polyethylene and linear low-density polyethylene in mixer, carrying out high-speed mixing, screw extrusion molding, cooling, modifying and ultrasonically processing.

SUN E, SUN Z, LI W, SHI S, ZHANG L

Manufacture of graphene nanosheet modified carbon fiber composite material used for e.g. aerospace, involves spreading graphene dispersion liquid containing polymer electrolyte on carbon fiber cloth surface, laying cloth alternately, impregnating resin glue into preform, heating and solidifying.

YAO J, LIU Q, WANG B, LIU H, ZHOU L, WANG F

Low dielectric composition useful in laminated plate of printed circuit board, comprises epoxy resin, hardener comprising flame retardant hardener and benzoxazine resin, halogen free flame retardant, accelerator, additive comprising inorganic filler, toughening agent and solvent.

YAO J, GONG J, CHEN S, TANG F

Foam electromagnetic shielding material with bulletproof function used in stealth airplanes, is prepared by superposing coated aramid fiber laid fabric blocks to obtain bulletproof aramid fiber chips to obtain foam electromagnetic shielding material precursor, and heating.

FU L, PAN Z, WU Z, LIU Y, FANG X, CUI Z, LI Z, XU D, AI Q, HU L, LI N, CHEN H

Preparing X-band stealth/lightning protection skin comprises laying up carbon fiber prepreg, conductive prepreg, wave-absorbing prepreg and wave-transmitting prepreg in sequence on surface of tooling, obtaining first skin, and molding first skin by vacuum bag process.

LI B, SONG Z, WEN Y, LIU Y

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

In-situ wetting conversion structure used in liquid drop dynamic control platform for liquid drop transfer, microfluidic and biochemical engineering comprises shape memory micro-structure surface covered on base body, and base body of electric heating film is dimethyl silicone polymer.

SUI X, SUN Y, XUE Y, WANG Y, LIANG W

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

Epoxy resin composite material comprises component A and component B that are compounded with each other, where component A includes epoxy resin, preservatives, ultra-fine light calcium carbonate powder, graphene, and component B including carbon fiber mixed cloth woven from carbon fiber threads.

ZHANG W, FEI G, YUAN S