国家/地区 日本（16）
IPC部 C（16） H（9） B（8）
G（3） D（2）
IPC大类 C08（16）
IPC小类 C08K（16）
IPC C08L063/00（16）
发明人 YANAGISAWA T（2）
公开年 2012（3） 2022（3）
申请年 2011（3）  2021（3）  2012（2）  2013（2） 
专利权人 GSI CREOS CO.（2） SAMSUNG ELEC.（2）

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Electroconductive particles used for conductive resin, are obtained by coating surface of polymer particles with graphene in preset average coverage ratio.

TAMAKI E, YANG H X

Sliding engine component e.g. half bearing shell, for e.g. internal combustion engine, has composite layer comprising matrix of plastic polymer-based material with functionalized graphene nano platelets distributed throughout matrix.

LAING I M, LATHAM D, GORGES R, LAING I, LANE I

Graphene dispersed composition used for manufacturing carbon containing resin laminated material, comprises graphene oxide, hardening agent, epoxy resin and silane coupling agent having epoxy group as dispersing agent.

SHIMADA N

Forming a graphene-reinforced polymer matrix composite useful in an aircraft, comprises distributing graphite microparticles into molten thermoplastic polymer phase, and applying succession of shear strain events to molten polymer phase.

NOSKER T, LYNCH J, HENDRIX J, KEAR B, CHIU G, TSE S, HENDRIKS J, XIE S, ZHAO G

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S