国家/地区 中国（73） 世界知识产权组织（4） 韩国（2） 美国（2）
IPC部 C（78） B（11） H（11）
G（8） F（4） A（2）
D（2）
IPC大类 C08（78）
IPC小类 C08L（78） C08K（59） C08J（55）
C08G（26） C09D（12） C01B（6）
H05K（5） B29C（4） B32B（3）
B33Y（3） C08F（3） C22C（3）
F16F（3） H01B（3） B01J（2）
IPC C08L079/08（78）
发明人 PAN J（6） WANG Y（6） ZHANG L（6）
LI X（5） CHEN L（4） XU Z（4）
ZHANG X（4） CHEN Y（3） LI C（3）
LI G（3） LI L（3） WANG X（3）
ZHANG Y（3） DING P（2） DING X（2）
公开年 2022（59） 2023（19）
申请年 2022（78）
专利权人 GUANGDE TIAN.（6） BEIJING INST.（2） CHINESE ACAD.（2） GUANGDONG HO.（2）
PI ADVANCED .（2） QINGDAO ADVA.（2） UNIV BEIJING.（2） UNIV HARBIN .（2）
UNIV JIANGNA.（2） UNIV NANJING.（2） UNIV SHANGHA.（2）

Composition used to produce thermoset composite material comprises cyanate ester comprising difunctional cyanate ester compound and polyfunctional cyanate ester moiety and substituted bisimide compound comprising biscitraconimide compounds.

LA DELFA G, FOURNIER J, ABGOTTSPON M, MAYERHOEFFER U, ELLINGER S

Producing polyimide powder used in display, automobile, medical, battery, and aerospace, involves preparing polyamic acid solution, preparing polyimide mixed solution by heating polyamic acid solution, and filtering and drying precipitate present in mixed solution to obtain polyimide powder.

LEE H S, YANG M S, LEE I S, LEE H, YANG M

Preparing polyimide-based shape-memory composite aerogel by carrying out polycondensation reaction of diamine monomer and dianhydride monomer in N-methylpyrrolidone, placing obtained polyamic acid gel in water, freeze-drying, and dispersing polyamic acid filaments and graphene oxide in water.

LI L, GUO M, LIU T

Polyamideimide composite material useful for sealing valve body, comprises silicon dioxide/polyamide-imide composite material, epoxy resin, carbon fiber, acetone, dibutyl phthalate, graphene, vulcanizing agent, accelerators, and anti-aging agent.

TAO F, ZHU J

Bismaleimide resin composite material useful for carbon fiber prepreg, comprises o-diallyl bisphenol A, bismaleimide resin, accelerator, and graphene.

CHEN L, LIU H, JIAO L, LV X

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Polyimide film is obtained by imidization reaction of polyamic acid containing quinoline and beta-picoline as imidation catalyst and acetic anhydride as dehydrating agent.

JUNG H, WON D, WON D Y

Preparing 3D printing organic-inorganic composite airgel useful in e.g. thermal insulation materials comprises adding inorganic nanomaterials to polyamic acid solution, mixing, and carrying out sol-gel treatment to composite ink and freeze drying composite ink and heat imidizing.

YUAN S, YANG Y, LI L, LIU T, XUE T, FAN W

Preparing polyimide film comprises e.g. mixing film polyimides, thermally conductive fillers and solvents, uniformly dispersing to obtain mixed dispersion, and coating the dispersion on substrate, and synthesizing by polymerization.

NIU S, SUN X

Asphalt-based carbon fiber composite material used in e.g. aerospace structural and functional integration material, comprises asphalt-based carbon fiber, aromatic fused ring molecular inner layer, graphene middle layer and aromatic fused ring molecular outer layer.

YANG X, GAO S, JIANG X, LI G