国家/地区 中国（10）
IPC部 C（10） B（2）
IPC大类 C08（10）
IPC小类 C08K（10） C08L（10） C08J（5）
C08G（3） C09K（3）
IPC C08L079/08（10）
发明人 CHEN C（10）
公开年 2018（4） 2021（2） 2022（2） 2023（2）
申请年 2021（3）  2017（2）  2023（2） 
专利权人 UNIV JILIN（5） JIANGSU YABA.（2）

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing polyimide composite material with double thermally conductive network comprises e.g. mixing polyamic acid powder, water, triethylamine and first thermally conductive filler, freeze-drying, performing thermal imidization, vacuum-impregnating and hot-pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Preparing organic resin composite material with 3-dimentional polyimide as thermally conductive framework comprises e.g. mixing thermally conductive filler, aromatic dianhydride and mixed solvent to perform esterification reaction.

ZHAO X, ZHAO J, WANG C, WANG D, ZHOU H, CHEN C

Preparing organic resin composite material with three-dimensional (3D) polyimide as thermally conductive skeleton by mixing aromatic diamine, aromatic dianhydride and organic solvent to perform polymerization reaction, and vacuum degassing.

ZHAO X, ZHAO J, CONG B, WANG D, ZHOU H, CHEN C

Porous graphene electromagnetic wave absorbing material used e.g. in radiating soundproof material or device comprises multiple components of nanoparticles, epoxy resin, foaming agent and graphene microchip.

WEI X, CHEN C, QIN S, DING J

Graphene-reinforced polyimide nanocomposite for preparing protective structure having corrosion protection properties, comprises graphene two-dimensional nanosheet, polyimide, and polyaniline nanofibers and/or polyaniline nanoparticles.

ZHAO H, QIN S, QIU S, CUI M, CHEN C, WANG L

Composite polyimide film comprises polyimide resin polymer comprising graphene, titanium dioxide, silica sol, fluoroacrylate copolymer and polyimide resin, fullerene, rare earth oxide and modifier.

XU W, WANG Y, QI X, JIANG X, CHEN C

Polymer of graphene composite polyimide resin used for preparing polyimide film comprises graphene, titanium, silicon sol, fluorine-containing acrylate copolymer and polyimide resin allowance.

XU W, WANG Y, QI X, JIANG X, CHEN C