国家/地区 中国（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08F（8）
IPC C08L079/08（8）
发明人
公开年 2019（2） 2022（2）
申请年 2019（3）  2022（2） 
专利权人

UV-curable material formulation in municipal pipeline repair, city construction, automobile, aerospace, building, day and the development of high molecular composite material and the application of each industry in each row, comprises vinyl resin, modified epoxy resin, acrylic polyurethane.

JIN W, DAI D, HUANG S, DU G

Preparing flexible cable used as electric energy or signal transmission device, involves spraying polymer microsphere on cable core, modifying modified graphene oxide, N,N'-(4,4'-methylene diphenyl)bismaleimide, coating sheath material on surface of irradiated cable core and rolling.

LUO X

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

5 G-polyphenylene sulfide film comprises polyphenylene sulfide resin, hyper-branched polyimide, fluorophosphorus co-doped nano mica powder, fluorinated graphene, and phosphorus pentoxide.

XIA C

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Preparing graphene composite film comprises performing stripping treatment to e.g. graphene oxide, organic modifying, adding pre-mixture, performing vacuum deaeration, coating, heating polymerization, drying, winding, washing and drying.

INVENTOR U

Producing modified graphene-based polymer material comprises e.g. mixing graphene, polymethyl methacrylate and absolute ethanol, adding copolymer plate into liquid resin matrix to obtain mixed solution N, and thermoforming.

YU F

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN