国家/地区 中国（12） 美国（2） 世界知识产权组织（2）
IPC部 C（12）
IPC大类 C08（12）
IPC小类 C08K（12）
IPC C08L079/08（12）
发明人 LIU X（2） MA C（2）
公开年 2021（12）
申请年 2021（7）  2019（3）  2020（2） 
专利权人

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Preparation of low dielectric constant liquid crystal polymer (LCP) film, involves acetylating hydroxyl-containing aromatic monomer, polymerizing acetylated monomer, performing transesterification reaction, ball milling and mixing liquid crystal polymer and filler, melting and plasticizing mixture.

XU L, YU R, ZHANG D

Method for preparation of hybrid membrane used for solar sea water desalination, involves adding high molecular polymer into solvent under high temperature stirring condition, combining material with high thermal conductivity and high photo-thermal conversion capability forming composite material.

HE L, LIU R, GE C, GUAN H, ZHANG X, MA C

Preparing polyimide/graphene composite thermally conductive film, involves performing polycondensation of dianhydride, crosslinking polyamic acid and polyvinyl alcohol followed by subjecting film-forming mixture to thermal imidization.

XU Z, LIU G, ZHANG Q

Preparation of graphene/polyimide composite foam wave-absorbing material with oriented hole structure e.g. for aerospace by mixing graphene oxide dispersion liquid and polyamic acid/triethylamine aqueous solution under magnetic stirring.

WANG Z, LIU T, ZHANG Y, LI S, TANG X

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Preparing thermally conductive composite material useful in radiating field of electronic device, comprises e.g. obtaining three-dimensional porous graphene by laser processing polybenzoxazine resin, casting polymer fluid, and curing.

ZHAO W, LIU X, YU W, JIANG Y

High heat-conducting four-needle-shaped composite particle/polyimide film useful in electronic materials e.g. thermal management materials and interface materials, comprises heat-conducting filler, surfactant and polyamic acid solution.

MA C, CHI H, LIU D, ZHANG P, DAI P

Preparing thermally conductive polymer composite material with multi-level continuous network structure by preparing network , soaking in dispersion, drying, soaking in polymer aqueous solution or polymer precursor solution, and drying.

QIN M, CHEN L

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B