国家/地区 世界知识产权组织（33）
IPC部 C（33） H（10） B（9）
A（2）
IPC大类 C08（33）
IPC小类 C08L（33） C08K（30） C08J（14）
C08G（12） C01B（8） C09K（8）
C09D（5） H01L（5） H05K（4）
B01J（3） B29C（3） B82Y（3）
H01B（3） B32B（2） C09C（2）
IPC C08L083/04（33）
发明人 FUJIMOTO T（2） GUO F（2） LI C（2）
LI Y（2） LIU L（2） MAO Y（2）
PARK K H（2） PENG F（2） WANG H（2）
WANG L（2） WANG T（2） WEN S（2）
XU Y（2） ZHANG F（2）
公开年 2021（11） 2022（8） 2019（4） 2023（3） 2012（2） 2016（2）
申请年 2021（9）  2020（6）  2022（5）  2018（3）  2019（3） 
专利权人 FUJI POLYMER.（2） GOERTEK INC（2） HUAWEI TECHN.（2） LIU L（2）
MAO Y（2） MOMENTIVE PE.（2） TUNGHSU OPTO.（2） TUNGHSU TECH.（2）
UNIV BEIJING.（2） WEN S（2） ZHANG F（2）

Two-part curable composition used in electric motors, comprises part comprising metal catalyst, non-reactive diluent, wetting agent, filler, rheology modifier and pigment, and another part comprising polyurethane polymer, moisture scavenger, non-reactive diluent, filler and wetting agent.

VEERARAGHAVAN T, SENGOTAIYAN K, VEERARAGHAVAN S, VEERARAGHAVAN T T

Resin-based formulation used as paint formulation e.g. dry paint formulation for coating oil rig, comprises resin material, filler material and graphene flakes.

SAMSUDIN M S F B, ABA N D B, ZAKARIA M B, MOHAMMED NOR A B

Composition used for forming film heater, comprises binder resin containing resol phenolic resin, conductive particles comprising carbon nanotubes, adhesion enhancer comprising polyvinyl acetal, and heat resistance enhancer comprising silsesquioxane powder.

KIM Y J, YOU G J, JANG S H, KIM H J, PARK G H, HONG B K, YOONJIN K, YU G, HYUN C, PARK K H

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Producing polydimethylsiloxane composite reinforced with three-dimensional conductive porous carbon by preparing aerogel having porous structure from mixed solution having graphene oxide, polyvinyl alcohol and formaldehyde, annealing aerogel, and bonding annealed aerogel with polydimethylsiloxane.

SUHR J H, SUN Y, HONG S Y, SUHR J

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Photocurable silicone composition for e.g. forming three-dimensional product, comprises olefin polysiloxane comprising side chain comprising strained cyclic functional group comprising carbon-carbon double bond and/or termination comprising strained cyclic functional group, and mercapto polysiloxane.

GAUTROT J E E, NGUYEN K D Q

Electroconductive composition used for forming adhesive patch/tape, comprises homogeneous dispersion containing single walled carbon nanotubes and dielectric polymer matrix material.

ROYCE J, BOBENRIETH A, MAES L, THOMAS X, MAAS L, LHOEST J, BOBENRIETS A, MAZE R

Manufacturing flexible sensor, involves dispersing graphene in polymer polymeric material, adding carbon nanotube to polymer polymeric material, applying alternating current field to polymer polymeric material, attaching polymer polymeric material film to composite material, heating and curing.

XU X, HAN J, ZHANG W, XU C, SU W, CHEN J, WANG L