国家/地区 中国（23） 韩国（3） 世界知识产权组织（3）
IPC部 C（27）
IPC大类 C08（27）
IPC小类 C09J（27） C08G（14） C08K（10）
C08L（9） B32B（5） C08F（5）
C08J（3） B29C（2） C09D（2）
IPC C09J011/04（27）
发明人 LIU Y（2） WU X（2）
公开年 2022（15） 2023（12）
申请年 2022（27）
专利权人

Processing wire-drawing aluminum-plastic composite plate useful in household decoration field, comprises e.g. mixing octafluoropentanol and tetrahydrofuran solution, stirring, mixing hexachlorocyclotriphosphazene, reacting, melting, extruding, molding, adhering adjacent plates and hot pressing.

QIAN C

Preparing high-temperature-resistant flame-retardant expanded polystyrene foam board comprises uniformly mixing and stirring to become main ingredient including melamine resin, and high temperature resistant filler, and pasting the two load-bearing boards on both sides of the composite board.

HE Y, RUAN X

Cyclic silicon-hydrogen bond-containing crosslinking agent useful in preparing adhesive sealant composition for inductors, comprises gamma-methacryloxypropyltrimethoxysilane, tetramethylcyclotetrasiloxane, graphene oxide, first platinum catalyst and methylbutynol.

WU Z, CAI X, LI F, WU X, ZHOU Q

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Thermally-conductive pressure-sensitive adhesive useful in preparing thermally-conductive pressure-sensitive adhesive film, and in power batteries of energy vehicles, comprises epoxy resin composition, acrylate copolymer, thermally-conductive filler, curing agent, and photoinitiator.

JIANG B, ZHANG Z, YU D

Single-component thermally conductive hot-melt polyurethane adhesive useful in electronic products comprises polyester polyol, polyether polyol, heat-conducting medium, flame-retardant medium, isocyanate and additive.

CHEN Z

Preparing high-reliability epoxy resin absorbing adhesive film with controllable fluidity by mixing epoxy resin matrix and toughener to compound epoxy resin system, placing epoxy resin system, absorbent, and inorganic filler into resin internal mixer for banbury rough mixing and fine mixing.

GONG Y, LIU J, LI M, LI Y, LV T

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J

Preparing environmentally-friendly aqueous adhesive useful in manufacturing containers, comprises e.g. reacting silicon carbide nano-wire with 3-amino propyl trimethoxy silane and graphene to obtain modified silicon carbide nanowire and reacting with polyurethane emulsion and methyl methacrylate.

LIU Y, QU L

Repairable hydrogel composition useful for adhesives and metal substrates, comprises aromatic substituent based acrylate compounds and polyvinyl alcohol.

DU L, LIU B, DENG F, DOU J