国家/地区 中国（19）
IPC部 C（19）
IPC大类 C08（19）
IPC小类 C08G（19）
IPC C08J005/18（19）
发明人 TANG B（2） TANG F（2）
公开年 2021（5） 2015（3） 2020（3） 2022（2）
申请年 2020（4）  2021（4）  2015（3）  2019（2） 
专利权人 TONGLING SHE.（2）

Preparing boron-doped fluorinated polyimide film used in supercapacitor, involves obtaining polyimide by weighing certain amount of diamine, and four organic solvent and adding into mouth flask, stirring at normal temperature to diamine to dissolve, and weighing certain mass of dianhydride.

LI X

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Preparing polyimide/graphene composite film used in in OLED display, involves performing ultrasonic reaction to the graphene oxide and thionyl chloride to obtain the acyl chloride graphene.

JIN W, LIU G, HU T

Preparing electromagnetic wave shielding thermoplastic polyurethane involves putting polytetramethylene ether glycol, butanediol, isocyanate, antioxidant, yellowing-resistant agent and catalyst into reaction vessel under heating.

HE P

Conductive polyaniline composite material used for preparing printable film electrode material and in thin film batteries, comprises template material, aniline monomer, 4-dodecylbenzenesulfonic acid, initiator, peroxide, and water.

LAI S, WAN X, GAO M, HU K, CHEN Z, QIAN Y, CUI H, ZHANG M, GUO X, GUO C

Conductive ion gel membrane for e.g. sensor, comprises film substrate comprising polyacrylic acid hydrogel and conductive nanofiller dispersed in polyacrylic acid hydrogel, and polyaniline coating formed on surface of film substrate.

XING M, YE H, LIU K, GUO Y

High dielectric polyimide film comprises polyimide and graphene oxide uniformly filled in the polyimide.

XU J

Preparation of cesium lead halide/reduced graphene oxide/polyimide composite film used for preparing high temperature film capacitor, by reacting 4,4'-diaminobiphenyl and 3,3',4,4'-biphenyl tetracarboxylic dianhydride with stirring.

PENG X, KONG M, ZHU Z, HOU H

Nano-nickel ferrite-supported graphene-based absorbing material comprises phosphorus-doped graphene oxide, nanoporous nickel ferrite (NiFe2O4), and paraffin wax.

ZHANG R

Modified graphene oxide used as a special functional plastic in advanced semiconductor packaging, is a graphene oxide modified by a curing accelerator, where organic solution is prepared by dissolving graphite oxide in an organic solvent.

LI J, WANG T, ZHANG G, SUN R