国家/地区 中国（51） 美国（4） 世界知识产权组织（2）
IPC部 C（53） B（6） H（2）
IPC大类 C08（53）
IPC小类 C08G（53）
IPC C09K005/14（53）
发明人 ZHANG W（6） LIU Y（4） XU Y（3）
ZHENG Y（3） CHEN C（2） DING P（2）
FERRARI A（2） GUO H（2） HODGE S（2）
HUANG F（2） LI H（2） LI M（2）
LIN Y（2） QIU Y（2） SHI L（2）
公开年 2018（12） 2017（10） 2020（10） 2021（8） 2022（5） 2023（4） 2019（2）
申请年 2017（11）  2020（9）  2016（7）  2018（6）  2021（6）  2019（5）  2022（5）  2015（2）  2023（2） 
专利权人 HEZHOU BAOXI.（6） HUAWEI TECHN.（2） SHENZHEN INS.（2） UNIV CAMBRID.（2）
UNIV FUZHOU（2） UNIV GUILIN .（2） UNIV JILIN（2） UNIV SHANGHA.（2）

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing graphene/zirconium-BDC-metal-organic framework/perovskite quantum dot high thermal conductivity composite material comprises e.g. dispersing quantum dots in toluene, taking zirconium oxychloride octahydrate, washing, placing sodium nitrate into beaker, adding sulfuric acid and compounding.

WANG S, LUAN Y

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Preparing thermally conductive filler for highly thermally conductive elastomer comprises e.g. adding composite thermally conductive material and grafted graphene oxide to mixed solvent of ethanol and water, ultrasonically dispersing, grinding, transferring to reaction vessel, and precipitating.

LIU Y, ZHONG R, LI T

Flexible heat dissipation material comprises polymer masterbatch modified by hydroxylated boron nitride nanosheets; functionalized graphene; and polymer.

LI X, HE Y, GUO H

Composition comprises poly(arylene ether), where poly(arylene ether) is polymeric reaction product of one disubstituted benzophenone and polyol and one polyol comprises one fluorinated diol.

CONNELL J W, BELCHER M A, GHOSE S

Graphene/liquid crystal epoxy resin high thermal conductivity composite material comprises liquid crystal epoxy resin, liquid crystal functionalized magnetic graphene and curing agent.

WANG Z, ZHANG X, ZHAO Q, ZHANG T, CHEN F

Preparing polyimide/graphene composite thermally conductive film, involves performing polycondensation of dianhydride, crosslinking polyamic acid and polyvinyl alcohol followed by subjecting film-forming mixture to thermal imidization.

XU Z, LIU G, ZHANG Q