国家/地区 韩国（15）
IPC部 C（15）
IPC大类 C08（15）
IPC小类 C08G（15）
IPC C08K003/04（15）
发明人 CHI S（2） CHO J（2） CHOI S（2）
JI S Y（2） JIN R（2） KIM S（2）
KIM S H（2） KIM Y S（2）
公开年 2023（3） 2011（2） 2012（2） 2021（2）
申请年 2021（5）  2011（2）  2012（2） 
专利权人 SAMSUNG ELEC.（3） KOREA INST S.（2） TICONA LLC（2）

Composition useful in e.g. article, preferably flexible display device of electromagnetic wave shielding film and for transportation devices comprises graphene oxide, nano cellulose, reducing agent comprising hydroxy and amino group.

HONG S W, BAE S, HONG P H, LEE Y, HANUI K, CHOI K W, NO A

Preparing hydrogel for energy storage device, involves forming pre-gel comprising polymer and metal salt particles, shrinking and dehydrating pre-gel and impregnating shrunk and dehydrated pre-gel with ion solution to cross-link and rehydrate shrunk and dehydrated pre-gel to produce hydrogel.

JI D, KIM J Y, HWAN J D

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Bio-electrode composition used in contact with skin of living body for detecting physical conditions such as heart rate, comprises (A) reaction composite comprising ionic polymer material and carbon particle.

HATAKEYAMA J, SHANRUN

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Making nanoparticles of target material, involves mixing graphene oxide with aqueous solvent to give aqueous solution, mixing target material with organic solvent to give organic solution, and mixing aqueous solution with organic solution.

LIM J A, SONG Y, HONG J, YOO D Y, KIM H, SONG Y W, HONG J M, KIM H S

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN