国家/地区 中国（127） 世界知识产权组织（11） 韩国（8） 欧洲专利局（EPO）（6） 美国（6） 台湾（4） 日本（3） 加拿大（2） 英国（2）
IPC部 C（140） B（32） H（15）
D（6） G（4） F（3）
A（2） E（2）
IPC大类 C08（140）
IPC小类 C08L（140）
IPC C08L063/00（140）
发明人 ZHANG X（10） LI Y（8） WANG Y（8）
LI J（7） WANG J（7） WANG L（7）
LI Z（6） LIU Y（6） WANG B（6）
WANG D（6） CHEN Y（4） LI H（4）
LI M（4） LIU J（4） WANG Z（4）
公开年 2021（84） 2022（54） 2023（2）
申请年 2021（140）
专利权人 LANZHOU CHEM.（3） SICHUAN EM T.（3） AEROSPACE RE.（2） AEROSPACE SP.（2）
ANHUI GLANT .（2） GUANGDONG PO.（2） HANGZHOU FUX.（2） HARBIN INST .（2）
PALO ALTO RE.（2） UNIV BEIJING.（2） UNIV JILIN（2） UNIV SHAANXI.（2）
XINHUA SHANG.（2）

Flexible polymer heat dissipation sheet comprises matrix resin containing nitrile-butadiene rubber, acrylic resin, epoxy resin, phenoxy resin, urethane resin, and/or silicone resin, graphene particles and dispersing agent.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Producing film-type carbon material, comprises e.g. mixing epoxy resin and grapheme, preparing carbon material precursor having continuous skeleton, and heat-treating to carbonize film-type carbon material precursor.

KIM J P, KIM K S, CHOI D Y

Manufacturing heat dissipation sheet e.g. for light-emitting diode lighting lamp comprises e.g. mixing heat dissipation sheet main raw material of conductor powder and additives in bind composed of liquid nitrile rubber-modified epoxy resin.

BAEK L J

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Composition of matter is used in method of manufacturing composite material, comprises macroparticles comprising particles of one or more continuous phase matrix materials, and functionalized microparticles contained at least partially in one or more matrix material.

IFTIME G, WEI J, BENEDICT M

High heat conducting graphene magnetic composite material comprises graphene film layer and substrate layer, where preparation raw material of graphene film layer comprises graphene, composite base material and solvent, and substrate layer comprises soft magnetic material and hard magnetic material.

LIN Y, JIANG X, CHEN F, JIANG W, FANG W

Composite material used for fabricating load-bearing structures, comprises reinforcement fibers impregnated with thermoset resin composition comprising epoxy resin component, curative component comprising 4,4'-methylenebis(2,6-xylidine), and thermoplastic component.

RESTUCCIA C L

Glass or carbon fiber filled sheet molding compound (SMC) composition used to make vehicle part, comprises graphene for providing improved Izod impact strength, flexural strength and tensile properties over SMC composition without graphene.

ASTHANA S, PACHHA R