国家/地区 中国（86） 世界知识产权组织（7） 美国（4） 台湾（2）
IPC部 C（90）
IPC大类 C08（90）
IPC小类 C08K（90）
IPC C08K007/00（90）
发明人 LI J（4） LI X（4） LI Z（4）
ZHANG J（4） ZHAO J（4） CHEN C（3）
FENG Y（3） GUO J（3） LIU Y（3）
SUN R（3） TANG W（3） WANG D（3）
YANG L（3） ZHANG Y（3） ZHAO X（3）
公开年 2017（17） 2018（17） 2021（17） 2022（14） 2020（9） 2019（4） 2023（4） 2012（2） 2013（2） 2014（2）
申请年 2017（18）  2020（17）  2021（12）  2018（9）  2022（9）  2019（8）  2016（7）  2012（2）  2013（2）  2014（2）  2023（2） 
专利权人 SHENZHEN INS.（3） UNIV JILIN（3） ENN GRAPHENE.（2） GUANGDONG NA.（2）
NINGBO INST .（2） NISSAN MOTOR.（2） SHANGHAI ALL.（2） UNIV PEKING（2）
UNIV SOUTH C.（2）

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Heat-conducting gel for battery filling, comprises silicone A, thermal conductive filler, cross-linking agent as component A, and silicone B, catalysts, chain extender as component B, and prepared by mixing silicone A, thermally conductive filler and crosslinking agent to obtain component A.

LIN Y, CHEN F, XIANG L, JIANG X

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Thermally conductive film for heat dissipation structure, is formed by arranging binder and scale-like carbon materials formed by graphene layers, and making portion(s) of minor axis of binder and minor axes of spaces formed by carbon materials and binder smaller than minor axis of carbon materials.

NAITO T, TSUKADA Y, KENEKO T, YAJIMA A, SHIRATORI K

Heat conductive film used for head-up display, is configured by disposing scale-like carbon material formed by graphene layers such that adjacent scale-like carbon materials contact each other, and such that major axis of scale-like carbon material is oriented in surface direction of film.

KANEKO T, NAITO T, TSUKADA Y, YAJIMA A, SHIRATORI K

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

New modified lignin dispersant i.e. (4-(3-hydroxy-2-phenoxypropyl)phenol) useful for improving the dispersibility of two-dimensional materials and in thermally conductive cellulose composite film for electronic packaging materials and thermal conductivity materials.

ZHENG Y, QIU X, LIN X, XU S, ZHENG J, QI Y, HU Z, QIN Y, LIU Y

Flexible cellular foam product used for article e.g. mattress, comprises flexible foam substrate, and coating layer comprising highly thermally-conductive nanomaterial, and binder which is at least one chosen from, e.g. acrylic polymer emulsions and styrene-butadiene latex.

STOJANOVIC H, SCHERREY A N, CRAWFORD M L