国家/地区 中国（12） 世界知识产权组织（3）
IPC部 C（15） B（2） H（2）
IPC大类 C08（15）
IPC小类 C08K（15）
IPC C08L063/00（15）
发明人 PAN Z（2） ZHOU M（2）
公开年 2022（15）
申请年 2022（8）  2021（5）  2020（2） 
专利权人 ANHUI AEROSP.（2）

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

Preparing epoxy resin composite thermal conducting sheet useful in the technical field of functional sheet materials, comprises e.g. mixing the fluorinated graphene thermal conducting film, phthalic anhydride and ether, coating the mixed slurry and peeling off epoxy resin composite material layer.

PAN Z, ZHOU M

Preparing graphene composite material with thermal conductivity comprises adding aggregate and solvent to obtain mixture, mixing and stirring to obtain graphene composite slurry and injecting graphene composite slurry into mold to carry out staged heating reaction.

YANG Z

Preparation of shape memory epoxy foam composite material for shape memory plugging agent, involves mixing aqueous dispersion of nano particles with epoxy monomer, stirring to form Pickering emulsion and adding curing agent into pickering emulsion, pouring emulsion into mold, heating and curing.

QIN W, GU L, HE S, MA Q, ZHOU D, WU Y, FENG H, LIU L, XING X, LI Z

Preparing graphene-based wave absorbing honeycomb useful is in radar stealth material comprises mixing tubular graphene, alicyclic epoxy resin and organic solvent, grinding, coating obtained tubular graphene/alicyclic epoxy resin to honeycomb core hole wall and drying.

YANG R, ZHAO Z, LIU R

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Preparing pre-constructed three-dimensional graphene network and thermal conductive composite material comprises mixing graphene and pore-forming materials, uniformly dispersing, and compressing with specific pressure, and curing the prepreg.

ZHU J, CHEN Y, ZHANG L, JIA W, LI X